FOL Development Staff Engineer

Job Responsibilities

1. Power Package & Module Development

   • Lead the end-to-end design and development of high-power discrete and power module packages.
   • Translate customer requirements into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD).
   • Collaborate with design, materials, and process teams to define optimized package structures and assembly flows.
   • Apply Design for Manufacturability (DFM) principles to ensure robust production, cost control, and quality compliance.
   • Develop and maintain technical documentation including DFMEA, PFMEA, QFD, LAR plans, control plans, and procurement specifications.
   • Oversee electrical, thermal, and reliability characterization and qualification activities.
   • Contribute to the development and maintenance of the Wide Bandgap (WBG) packaging technology roadmap.

2. New Product Introduction (NPI) Project Management

   • Manage complete NPI project timelines, deliverables, and risk mitigation activities.
   • Lead prototyping, proof-of-concept builds, qualification runs, and transition to high-volume manufacturing (HVM).
   • Conduct technical design reviews and lead phase gate execution.
   • Collaborate with Business Units (BU), QA, manufacturing, and application teams to ensure aligned project execution.
   • Use structured problem-solving methods such as 8D and RCCA for resolving design and process challenges.
   • Ensure compliance with internal NPI frameworks and customer-specific milestones.

3. Leadership & Technical Influence

   • Mentor junior engineers and foster a strong, innovation-driven technical culture.
   • Contribute to continuous improvement initiatives and share best practices across cross-functional teams.
   • Support customer audits and lead technical discussions during product qualification phases.

Job Requirements

1. Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering, or a related field.

2. At least 5 years of experience in high-power discrete or power module packaging development.

3. Proven track record in leading NPI projects from concept through HVM transfer.

4. In-depth knowledge of FOL (Front-of-Line) processes, including:

   • SiC wafer dicing
   • Heated die attach (DA)
   • Cu/Ag wire/ribbon bonding
   • Solder reflow and gel-fill modules
   • Thermal and electrical design optimization

5. Familiarity with JEDEC, AEC-Q100, and relevant reliability standards.

Key Skills

1. Technical Expertise

   • Power package design and device-package interaction
   • Material selection and reliability testing
   • Alignment with Wide Bandgap (WBG) packaging roadmaps

2. Analytical Tools & Software

   • AutoCAD, JMP, Minitab
   • Microsoft Excel, PowerPoint, and technical report writing

3. Project & Risk Management

   • Strong skills in NPI planning, risk-based thinking, and milestone tracking

4. Communication & Collaboration

   • Clear communication across departments and with customers
   • Ability to influence and lead in cross-functional technical discussions

5. Problem Solving & Innovation

   • Proficient in 8D, RCCA for root cause analysis
   • Continuous improvement mindset (Lean, Six Sigma preferred)