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FPGA Product Engineering Manager

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Onsite

FPGA Product Engineering Manager

Private Advertiser

FPGA Product Engineering Manager

Skills

Product ManagementTesting & QA

11 days ago

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Important information


Contract type:

Permanent

Location:

George Town, Penang, Malaysia

Work mode:

Onsite

Published on:

15 October 2026

What they need


Position Overview

To support expanding FPGA product roadmap we are seeking a highly motivated and technically accomplished FPGA Product Engineering Manager to drive both the product lifecycle and operational scaling of our FPGA product portfolios. Thismanagerial role bridges the gap between engineering, product strategy, and global manufacturing operations. The Product Manager will lead the Product Engineering team be responsible in taking FPGA products from concept through high-volume production, managing outsourced partners, optimizing product yields and driving cost reductions throughout the product lifecycle.

Key Responsibilities & Deliverables

Product Rollout and NPI

  • Product Rollout: As the focal person to work with cross functional teams to develop the product across PLC from design, post-silicon power on, deliver customer samples, and continue drive the product rollout at ramp to HVM.
  • NPI: Identify, analyze, root cause and solve product issues during NPI ramp for manufacturing readiness in high volume.

Manufacturing Operations & OSAT Management

  • OSAT Vendor Management: Serve as the primary product interface with OSAT partners to ensure production timelines and quality standards are met.
  • Manufacturing Setup: Lead the strategy and execution for new product introduction (NPI) manufacturing flows, packaging, and production test setups.

Yield & Cost Optimization

  • Yield Improvement: Partner with Foundry, OSAT, and Product/Test Engineering teams to analyze test data, identify failure mechanisms, and drive continuous wafer sort and final test yield improvements.
  • Product Cost Reduction: Define and execute cost-reduction roadmaps through die size optimization, test-time reduction, packaging innovations, and aggressive negotiation of Bill of Materials (BOM) costs.

Leadership & Team Growth

  • Team Growing: Recruit, mentor, and build a high-performing team of product engineering as the product line expands.
  • Cross-Functional Alignment: Cross-collaborate between IC Design, Operations, Quality Assurance, Sales, and Finance to hit finance targets.

Role Specifications & Qualifications

  • Education: Bachelor’s degree in Electronics Engineering (E&E), Microelectronics Engineering,or a related technical field. A Master's degree is a plus.
  • Experience: >10 years of experience in product management, product engineering, or technical operations within the semiconductor industry, with a proven track record of managing product lifecycles.
  • Technical Proficiencies: Deep understanding of FPGA/ASIC architectures, semiconductor fabrication processes, and advanced packaging technologies.
  • Operation Expertise: Evaluating automated test equipment (ATE) data, and implementing yield enhancement methodologies. Direct experience working with international OSAT vendors us a plus.
  • Business Acumen: Demonstrated success in driving cost reductions and managing product gross margins.
  • Leadership Ability: Proven experience in a managerial or lead capacity with a strong desire to hire, develop, and retain technical talent.
  • Soft Skills: Exceptional problem-solving capabilities, cross-functional project leadership, and clear technical communication.

Preferred Qualifications

  • Prior hands-on experience in Semiconductor Product/Test Engineering.
  • Familiarity with high-volume manufacturing quality standards (e.g., ISO 9001, IATF16949 for automotive), and/or customer facing experience.

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