GaN Package Development Engineer

Key Responsibilities and Duties

Design & Risk Assessment

• Initiates the internal assembly design of the GaN device, BOM & Process flow in a target package footprint
• Prepared preliminary Build diagram and Package Outline Drawings.
• Conducts risk assessment and identification of mitigating actions to eliminate or reduce the risks. This will be in collaboration with OSAT development team and Navitas Operations/NPI teams
• Works with Simulation engineer for thermal and thermo-mechanical stress simulations as part of risk assessment of new designs.
• Lead cross-functional team reviews to finalize proposed design
• Defines new assembly package layout rules as reference for future designs

Package Development

• Drives all assembly validation activities to freeze Design-, BOM- and Process-of-records
• Performs Learning Cycle builds to validate design and material selection versus target performance
• Works with Rel team to execute Look-ahead reliability evaluations and post-stress construction analysis to assess package robustness
• Oversees the assembly of Final POR Qualification Lots at OSAT up to delivery of samples for Reliability testing
• Compiles and provides all relevant documentation under Package Engineering deliverables as per Navitas New Product Development Process

Customer Support

• Generates Engineering build requests for customer samples requested by BU
• Monitors assembly CTQs and yield performance of customer sample lots for CPK and yield analysis
• Generates Application notes for new packages to provide guidance for optimum board mount conditions of Navitas products.

Qualifications Required Qualifications

• Bachelors degree or MS degree in Semiconductor Engineering, Materials Science, Chemical Engineering or a related technical field.
• At least 15 years experience in Package design and development
• Strong understanding of power semiconductor device physics and manufacturing processes.
• Experience with SiC and/or GaN technologies preferred.
• Deep working knowledge of SPC, DOE, Cpk/Ppk analysis, FMEA, control plans, root-cause analysis, and yield analytics.
• Proven experience leading engineering projects and mentoring technical teams.
• Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.

Preferred Qualifications

• Package design using 2D CAD
• Understanding of FEA simulation techniques, reliability qualification standards, failure-analysis methodologies, and process excursion management.
• Experience in new assembly technologies for advanced power devices (ie flipchip, clip attach, Ag sinter, etc)
• Experience in leading or coordinating geographically distributed engineering teams.