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Graduate Talent (PQE SiD PFA)

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Graduate Talent (PQE SiD PFA)

Intel Corporation

Graduate Talent (PQE SiD PFA)

Skills

AIWorkdayProcess Improvement

1 month ago

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Important information


Contract type:

Permanent

Location:

George Town, Penang, Malaysia

Work mode:

Onsite

Published on:

27 September 2026

What they need


Job Details:

Job Description:

The Role and Impact

As a Product Failure Analysis Engineer at Intel, you will play a vital role in identifying and resolving product issues to enhance performance, quality, and reliability. You will conduct comprehensive failure analyses and collaborate with cross-functional teams to develop innovative solutions that improve product yield and reliability. Through your efforts, you will directly impact Intel's ability to deliver world-class technologies.

Business group

The role is part of Intel Corporation's Product Quality and Reliability organization, which focuses on ensuring Intel's products meet the highest standards of quality and reliability. This group supports Intel's mission by driving improvements in product performance, enhancing manufacturing processes, and advancing technology innovation.

Key Responsibilities

  • Perform failure analysis and root cause investigation on Intel products, including CPUs, SoCs, and AI interface graphic platforms.
  • Conduct failure analyses to identify defects and recommend corrective actions to design, fab, assembly, and test teams to improve product reliability.
  • Develop and refine failure analysis methodologies, tools, and processes to enhance efficiency and accuracy.
  • Collaborate with cross-functional teams to implement process improvements and innovative solutions for future technologies.
  • Maintain and optimize Failure Mode and Effects Analysis (FMEA) and control plans throughout product lifecycles.
  • Support new product launches, enabling technology transfers and toolset improvements across Intel sites.

Qualifications:

Minimum Qualifications

  • Bachelor's or Master degree in Electrical and Electronics, Physics, Microelectronics Engineering, or a related field.
  • 0-1 years of hands-on experience in failure analysis, device physics, or wafer fabrication processes, with demonstrated skills gained through internships, academic projects, coursework, or hands-on training.
  • Proficiency in technical areas such as failure analysis techniques, circuit analysis, and layout analysis.

Preferred Qualifications

  • Strong problem-solving and analytical skills demonstrated through academic or professional experience.
  • Ability to work effectively within cross-functional teams, showcasing excellent teamwork and collaboration skills.
  • Effective verbal and written communication skills, ensuring clarity in conveying technical findings and solutions.

Join us in shaping the future of technology and make an impact with Intel's innovative products.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Penang

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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