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Hardware Engineer (Physical Design)

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Onsite

Hardware Engineer (Physical Design)

Normal Computing

Hardware Engineer (Physical Design)

Skills

NodePythonRAI

14 days ago

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Important information


Contract type:

Permanent

Salary:

$200,000 – $400,000 / year

Location:

United States

Work mode:

Onsite

Published on:

9 October 2026

What they need


  • As a Physical Design Engineer at Normal, you will own the end-to-end silicon realization path, taking complex architectures from synthesis and physical floorplanning all the way through timing signoff and GDSII tapeout
  • Sitting at the intersection of custom ASIC design and our hardware-algorithm co-designed systems, you will shape physical feasibility early in the design cycle by working shoulder-to-shoulder with RTL and architecture teams
  • You’ll drive the full backend implementation flow—optimizing floorplanning, place-and-route (P&R), clock tree synthesis (CTS), static timing analysis (STA), and physical verification (DRC/LVS) to achieve aggressive power, performance, and area (PPA) targets
  • Physical Implementation & Flow: Lead the full netlist-to-GDSII physical design flow, including floorplanning, power grid design, placement, clock tree synthesis (CTS), and place-and-route (P&R)
  • Timing Closure & STA: Own static timing analysis (STA), timing constraints creation/validation, and signoff timing closure across all operating corners and modes
  • Power, Area, and Signal Integrity: Drive physical optimization for power, performance, and area (PPA), as well as power integrity (IR/EM) and crosstalk analysis
  • Physical Signoff & Verification: Execute full chip/block physical signoff checks, including DRC, LVS, ERC, and antenna fixes, ensuring seamless handoff to the foundry
  • Design & Floorplan Reviews: Collaborate closely with RTL, architecture, and DFT teams to influence early floorplanning, macro placement, pin assignments, and physical feasibility
  • Tapeout & Post-Silicon Support: Create and execute tapeout checklists, manage final stream-out processes, and support post-silicon physical debugging and bring-up as needed- We are looking for a seasoned engineer who thrives in cross-functional environments and takes pride in tapeout-proven execution
  • The ideal candidate brings a meticulous approach to physical signoff, maintains clarity in fast-paced build cycles, and is excited to solve the physical constraints of novel computing architectures
  • Backend Debugging Instincts: Strong problem-solving skills in analyzing and resolving STA timing bottlenecks, IR/EM drop issues, crosstalk, and complex DRC/LVS signoff violations
  • PD Flow Expertise: Deep hands-on experience with industry-standard physical design tools (e.g., Innovus, IC Compiler II, Tempus, PrimeTime, Pegasus, Calibre) across floorplanning, P&R, CTS, and signoff timing closure
  • Tapeout Track Record: At least 3+ successful tapeouts from netlist to signoff, ideally across advanced technology nodes
  • Cross-Functional Feasibility: Ability to collaborate effectively with RTL, architecture, and DFT teams to influence floorplanning, pin placement, and early physical feasibility
  • Experience at an AI or high-performance compute (HPC) chip startup where design, verification, and PD work in tight iteration cycles
  • Experience with custom memory/macro floorplanning, hierarchical top-level implementation, or advanced packaging (e.g., chiplets, 2.5D/3D integration)
  • Hands-on experience developing or maintaining automated TCL/Python scripting frameworks for physical design flows

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