IC Assembly/Subcon Engineer

Responsibilities:

• Responsible for Assembly and Test Backend Sustaining Engineering activities at all OSAT’s site.
• Responsible for Assembly and Test Backend yield and performance tracking and reporting.
• Develop and maintain Assembly and Test Backend-related specs and documentation.
• Responsible for Assembly and Test Backend Material Review Board (MRB) and deviation management.
• Drive continuous improvement program at OSAT.
• Support customer audit and supplier audit at assembly partners’ site.
• Collaborate with Quality Engineer on failure analysis and reliability-related activities with assembly partners.
• Contribute to cross-functional activities of NPI, product qualification and product bring-up at assembly partners’ site.

Requirements:

• Bachelor’s Degree in Science or Engineering discipline (Mechanical, Electronics, Physics, Chemistry, Material or related field).
• 3 years of semiconductor experience is a must for this position
• Good command of English in both speaking and writing.
• Good process knowledge about IC Assembly (FOL/EOL).
• Good understanding on IC packages (BGA/Flipchip /WLCSP/Leaded).
• Good understanding of Failure Analysis (FA), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis), and JEDEC standards.
• Good coordination, tracking and follow up skills on issues and projects.
• Good ability to solve problems with logical approach and good analytical skills.
• Ability to communicate with people at all levels, good working attitude and team player.
• Willingness to travel domestically and internationally to OSAT partner sites.
• Experience/knowledge on wafer process, ATE tester 1st level debugging and statistical data analysis will be added advantage.