成都钛和科技有限公司
高级项目经理 - 模拟IC
2 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
31 August 2026
What they need
该职位来源于猎聘 I.key Responsibilities
- The project manager is accountable to achieve defined project results.
- Lead NPI team to work on power device or package design, product development and new product qualification.
- Communicate with customers effectively on new product development, DFX and provide engineering proposals/solutions.
- Lead NPI team to execute SWR lots from FOL to Test without fail and resolve all engineering issue before mass production
- Lead cost improvement projects by introducing and qualifying new packaging materials.
- Provide coaching and technical assistant to the NPI engineering team to resolve internal and external technical unforeseen issue.
- Refine project budget as needed to ensure timeliness and fiscal responsibility
II.SKILLS /COMPETENCIES (Top 3-7 most important/critical competencies needed for the job both soft and hard skills): Hard Skills:
- Bachelor or master’s degree in engineering
- PMP/Prince2 preferred.
- Knowledge in state-of-the-art project management tools and their application
- Knowledge of semiconductor processes and packages
- Min 6-10 years’ experience in project management, semiconductor NPI or assembly area. Engineering experience in both FOL and EOL assembly preferred.
- Sound knowledge in DOE, APQP, PPAP, FMEA and Statistical Process Control.
Soft Skills
- Strong time management skills
- Delivering on commitment (PTS) – always demonstrating full accountability for project deliverables, “removing obstacles”
- Demonstrating “customer obsession” by actively looking for opportunities to reduce time to market.
- Ability to work in teams and collaborate effectively
- Ability to take initiative and drive for results
- Demonstrating “owners’ mindset”, critical judgement and the ability to build ‘winning teams’
- Good verbal and written communication skills. English, Chinese and/or Japanese.
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