捷普科技(上海)有限公司
数字IC设计
1 month ago
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Important information
Contract type:
Permanent
Location:
Hangzhou, Zhejiang, China
Work mode:
Onsite
Published on:
21 September 2026
What they need
该职位来源于猎聘 岗位描述 1.微架构定义/撰写集成电路设计规范 2. 逻辑模块的RTL编码 3. 模块级与顶层功能的仿真/验证 4. 进行模块级综合/时序分析 5. 撰写完整的设计/验证报告 6. 与相关模块功能相关的硅调试 7. 编写生产测试的测试模式。 任职资格: 电子工程硕士,至少3年及以上数字设计经验; 2. 必须具备高速低功耗数字设计的相关经验; 3. 熟练掌握数字设计构建模块(如数据通路、同步器、FIFO等); 4. 精通Verilog RTL编码、验证与调试技能; 5. 具备Cadence NC-Sim、Synopsys DC、PT等EDA工具的实际操作经验; 6. 具有DDR接口设计相关经验者优先; 7. 自我驱动且善于团队协作。
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