IC载板封装应用工程师

该职位来源于猎聘 Job Responsibilities

• As the key technical interface between clients and internal teams, this role is responsible for analyzing client requirements, evaluating technical solutions, and managing project onboarding, ensuring the smooth transition of products from the design phase to high-quality and on time NPI delivery.
• Possessing an in-depth understanding of semiconductor packaging technology, advanced packaging architecture, and packaging manufacturing processes, will be responsible for technical communication with customers, design reviews, and problem-solving. will accurately interpret customer requirements from the perspectives of system applications, packaging design, and manufacturing needs, and conduct technical feasibility analyses and risk assessments based on product performance, reliability, manufacturability, and cost requirements.
• Leads DFM (Design for Manufacturability) evaluations, combining IC substrate design rules, material properties, circuit capabilities, via structures, and key manufacturing capabilities to provide clients with design-manufacturing alignment recommendations, thereby improving product yield, reliability, and mass production feasibility.
• As a key driver of Design-to-Cost (DTC), integrates cost and manufacturability considerations into the early stages of product development. Identifies cost drivers and drives the achievement of target costs through material optimization, design rule evaluation, manufacturing capability alignment, yield improvement, and supply chain collaboration, optimal cost-effectiveness and project profitability while meeting performance and reliability requirements.
• Collaborate closely with Sales, Account Managers, R&D, Technology Development and Innovation (TDI), New Product Introduction (NPI), Product Engineering (PE), Procurement, Operations, Quality, and Supply Chain teams to drive technical solution reviews, cost analysis, quotation support, and NPI implementation, ensuring projects are delivered on schedule and to a high standard.
• Regularly report to management on project progress, cost analysis, budget planning, profitability assessments, and key business metrics to provide technical and commercial support for business decision-making. Qualifications
• Bachelor’s degree or higher in Electronic Engineering, Materials Science, Packaging Engineering, Mechanical Engineering, or a related field.
• At least 5 years of relevant work experience in IC substrates, semiconductor packaging, packaging application engineering, product engineering, DFM/DFX, or related fields.
• Depth knowledge on semiconductor packaging technology, advanced packaging architectures, and packaging manufacturing processes; familiarity with advanced packaging applications and technology trends.
• Strong engineering and technical problem-solving capability
• Strong understanding of product cost structures (materials, manufacturing processes, supply chain).
• Proficient in cost modelling / should-cost analysis and financial evaluation
• Excellent analytical, problem-solving, and data-driven decision-making skills.
• Strategic thinking balancing cost, quality, and time-to-market.
• Outstanding communication, negotiation, and facilitation skills.
• Fluent written and spoken English (additional languages a plus);