IC Design Engineering, Principal

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

**IC Design Engineer, Principal

Location: Zurich, Switzerland

Reporting to: Electronic Design Engineering, Senior Principal Engineer (based in Zurich)

Permanent full-time role** Position Overview As part of a fast-moving team, the principal design engineer will develop millimeter wave circuits for optical coherent applications. The candidate must be able to architect, design, layout, measure and productize SiGe and silicon-based ICs and be comfortable with frequencies above 30GHz.

Key Responsibilities

• Take an IC from concept through to productization
• Architect, schematic design, layout, hands-on laboratory characterization of high frequency ICs
• Manage project, support customers, work with test and application engineers

Job Qualifications

• Design experience with 30+ Gbps transimpedance amplifiers and linear modulator drivers
• Deep understanding of SiGe bipolar IC design or RF CMOS as well as analog design fundamentals
• Team leadership experience is an advantage
• Proven track record of mmWave, RF, and analog integrated circuit design
• Expert knowledge of Cadence schematic design and layout
• Experience with E&M modelling tools is a plus (EMX, ADS, HFSS, Sonnet, etc.)
• Ability to characterize products hands on in the lab
• Ability to support a product through the entire product development and release cycle
• Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels
• Willingness to travel when required
• B.S. plus 8 years of IC design experience
• M.S. plus 6 years of IC design experience
• Ph.D. plus 4 years of IC design experience