Piper Companies

Piper Companies is looking for a
IC Package Design Engineer
to join a cutting-edge start up
onsite Monday through Friday near San Jose, CA.
The ideal IC Package Design Engineer will lead the physical layout of advanced multi-die substrates that integrate multiple chiplets into a high-density, high-performance package.
Responsibilities for the IC Package Design Engineer
:
<ul>
<li>Lead the physical layout of complex multi-die substrates while supporting chiplet-based integration.</li>
<li>Collaborate with package integration, signal/power integrity, and mechanical teams to ensure successful layout implementation.</li>
<li>Drive routing feasibility and co-design alignment with floor planning, mechanical, and system constraints.</li>
<li>Own the full layout process, ensuring performance, manufacturability, and design quality.</li>
<li>Use industry-standard tools like Siemens Xpedition and Cadence Allegro APD to execute and refine substrate designs.</li>
</ul>
Qualifications for the IC Package Design Engineer:
<ul>
<li>8+ years of experience in substrate layout design for advanced packaging.</li>
<li>Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.</li>
<li>Strong background in physical layout and collaboration with ASIC, signal, and power teams.</li>
<li>Proficient in Siemens Xpedition and Cadence Allegro APD</li>
<li>Bachelor’s degree in Electrical Engineering preferred.</li>
</ul>
Compensation/Benefits for the IC Package Design Engineer:
<ul>
<li>Salary Range: $200,000 – $260,000 annually depending on experience</li>
<li>Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (if required by law), and Holidays</li>
</ul>
This job opens for applications on 10/15/2026. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: Package Layout, Substrate Design, Multi-Die Integration, Chiplet Packaging, Package Design, Siemens Xpedition, Cadence Allegro APD, Semiconductor Layout, ASIC, packaging technology, Package Design, Package Design Engineer, Substrate, MCM, Multi-die
SITE

IC Package Design Engineer - 169668

IC Package Design Engineer - 169668

This job is no longer available

Talents

Recruiters

About