mnosys sdn bhd
IC Package Layout Design
2 months ago
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Important information
Contract type:
Permanent
Salary:
MYR 66,000 – MYR 96,000 / year
Location:
George Town, Penang, Malaysia
Work mode:
Onsite
Published on:
9 September 2026
What they need
· Responsible for WLCSP/ WLBGA, eWLB package, Wirebond package & Flipchip package feasibility study, design & design review with OSAT & substrate suppliers.
· Perform laminate substrate physical layout and electrical analysis for success design tape out.
· Perform design rules and DFMEA update.
· Support drafting activities for substrate unit drawing, strip drawing, bond master & bonding diagram creation, update and submission in system.
· Participate in 2nd source supplier qualification activities
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