M
MediaTek
IC Package Senior Engineer/Technical Manager
2 months ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
4 September 2026
What they need
- Develop and evaluate the advanced IC Package technology. 2. Collaborate with the assembly subcontractors to complete the technology development. 3. Qualification and yield improvement for the advanced IC Packages. 4. Audit subcontractors.
Main Requirements and Qualifications
- MS degree (or above) in Science or Engineering.
- In depth understanding of IC package technology, cost structure, manufacturing, material, process.
- Familiar/experienced with advanced IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D/CPO related packages.
- Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/InFO/CoWoS.
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