IC Packaging, Senior Manager (IC封裝)

We are seeking an experienced IC Packaging Senior Manager to join our dynamic team. The ideal candidate will have extensive hands-on experience in automotive MOSFET/MCU packaging and a deep understanding of the physical characteristics of each packaging process. This role requires a proven track record in top packaging companies or packaging departments within leading IC companies. The IC Packaging Senior Manager will be responsible for driving packaging innovation and process optimization to achieve cost reductions without compromising reliability or quality.

Key Responsibilities:

• Lead and manage IC packaging projects, focusing on automotive MOSFET/MCU packaging (e.g., DFN5*6, QFN).
• Deeply understand and optimize the physical characteristics of each packaging process.
• Innovate packaging solutions to reduce costs while maintaining high standards of reliability and quality.
• Collaborate with cross-functional teams to implement process improvements and cost-saving initiatives.
• Stay updated with industry trends and advancements in IC packaging technologies.

Requirements:

• Hands-on experience in automotive MOSFET/MCU packaging, specifically DFN5*6 and QFN.
• In-depth knowledge of the physical characteristics of each packaging process.
• Experience working in top packaging companies or packaging departments within leading IC companies.
• Proven ability to innovate packaging solutions for cost reduction.
• Expertise in process optimization to achieve cost savings without sacrificing reliability or quality.
• Master’s degree or above from a top university is preferred.

Preferred Qualifications:

• Strong problem-solving skills and attention to detail.
• Excellent communication and leadership abilities.
• Ability to work effectively in a fast-paced, collaborative environment.