Industrial Engineer

• Perform capacity planning and line balancing across assembly (wafer saw, die attach, wire bond/flip chip, molding, plating, trim/form, singulation) and final test operations.
• Establish and maintain standard times, UPH (units per hour), and OEE targets using time studies, MOST, and equipment data.
• Analyze bottlenecks, WIP levels, and cycle time using Theory of Constraints and Little’s Law; recommend actions to improve throughput and on-time delivery.
• Develop manpower models and operator-to-machine ratios; support headcount planning and cost-per-unit analysis.
• Lead layout design and optimization for new lines, equipment installation, and relocations, including material flow and cleanroom constraints.
• Run continuous improvement projects using Lean, Six Sigma (DMAIC), Kaizen, 5S, and value stream mapping to reduce waste, setup/changeover time, and downtime.
• Support new product introduction (NPI) and package ramp by defining routing, process flow, capacity requirements, and line readiness.
• Build dashboards and reports on OEE, UPH, utilization, yield loss, and productivity; present findings to management.
• Collaborate with Process, Equipment, Quality, Production Planning, and Supply Chain teams to resolve cross-functional constraints.
• Evaluate automation, MES/EAP, and Industry 4.0 opportunities, and support cost-benefit and ROI analysis.
• Support customer and internal audits (IATF 16949, ISO 9001) on productivity and process-control topics where applicable.
• Ensure compliance with safety, ESD, and cleanroom requirements.

Due to urgency, applicants who can start immediately will be prioritized!

QUALIFICATIONS:

• Bachelor’s degree in Industrial Engineering, Manufacturing Engineering, or a related engineering field.
• 2–5 years of experience in semiconductor assembly/test or a similar high-volume manufacturing environment (fresh graduates with relevant internships may apply for junior levels).
• Working knowledge of semiconductor packaging flows (leadframe, substrate/BGA, QFN, SOIC, flip chip) is a strong advantage.
• Solid grounding in time and motion study, line balancing, capacity modeling, and layout planning.
• Familiarity with Lean Manufacturing and Six Sigma (Green Belt or higher preferred).
• Strong statistical and data analysis skills (SPC, DOE, regression).

Pay: Php18,000.00 - Php25,000.00 per month

Benefits:

• Additional leave
• Company Christmas gift
• Free parking
• Health insurance
• On-site parking
• Opportunities for promotion
• Paid training
• Pay raise
• Promotion to permanent employee

Application Question(s):

• Due to urgent requirement, can you start immediately?

Experience:

• Industrial engineering: 1 year (Preferred)

Location:

• Biñan City, Laguna (Required)

Work Location: In person