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Integration Principal Engineer

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Onsite

Integration Principal Engineer

Systems on Silicon Manufacturing Co Pte Ltd

Integration Principal Engineer

Skills

Change Management

1 month ago

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Important information


Contract type:

Permanent

Work mode:

Onsite

Published on:

21 September 2026

What they need


SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for a Principal Engineer to be part of our Integration diverse team of talent. You will be responsible to manage the integration of all modules' processes and the respective derivatives.

What you will be working on:

  • To provide a leading role in the developing, transferring and maintaining of advanced CMOS fabrication technology with good process capability and high yield.
  • Lead new technology transfer from mother fab or process development.
  • Owner of new tapeout prototype lots and ensure 100% success rate.
  • Drive process robustness improvement by providing root cause analysis and and collaborate improvement actions to meet 100% wafer acceptance test (WAT) Cpk goal & Baseline D0 target.
  • Drive process excursion control by providing root cause analysis to modules and collaborate improvement actions to meet wafer acceptance test out of control % / out of specification % (WAT OOC%, OOS%) goal and single wafer low yield (SWLY) and single lot low yield (SLLY) goal.
  • Collaborate with product engineer on product sensitivity related low yield and plan to do product specific process tuning to meet baseline D0 target
  • Work with Customer Engineering to resolve customer complaints and provide customers with required information to meet customer concern and satisfaction & customer caution index (CCS & CCI) goal.
  • Adhere to all FAB change management, safety & ISMS procedures
  • Continuous improvement in d0, WAT performance, new tape-out (NTO) success and people efficiency.
  • Ensure safety awareness
  • Lead sub-team in x-functional continuous improvement projects.

More About You:

  • Degree / Masters in Electrical/Electronics/Microelectronics/Material Science/Materials Engineering/Physics Engineering

  • At least 5 years of relevant PI/Yield Engineering working experience in semiconductor manufacturing environment

  • Strong understanding of device physics, advanced semiconductor process and SPC

  • Strong analytical and problem solving skills to lead 8D team for corrective and performance actions

  • Proficient in Microsoft business applications

  • Proficiency in PROMIS system, Klarity ACE & DataPower will be an added advantage

SSMC is firmly committed to upholding equal employment opportunities for all individuals. We strictly adhere to the Tripartite Guidelines on Fair Employment Practices (TGFEP), the Singapore Food Safety and Security Act 2025 (FSSA 2025), and the Singapore Code of Advertising Practice. All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

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