Interim Engineering Intern_2027_Hw

Job Summary

Job Area: Interns Group, Interim Engineering Intern - HW

Responsibilities

• SOC Hard Macro Physical Design
• SOC Validation Debug
• RF Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineer
• Design for Test (DFT)
• CPU Design

Requirements

• Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
• Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
• Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
• Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
• Excellent analytical and problem solving skills.
• Ability to collaborate and work in teams.
• Good verbal and written communication skill

Educational Background

Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE