Internship - Materials Innovation

As part of the materials innovation team and under the guidance of an assigned mentor, the student will undertake projects focused on advancing polymer materials for electronic packaging. The role will involve exploring “state-of-the-art” polymer solutions, simulating and calculating key material properties, and contributing to formulation development for Encapsulating Material Compounds (EMC). Additionally, the student will investigate the application of AI in accelerating materials discovery and development.

Your role
Key responsibilities in your new role

• Literature Review: Conduct literature review of specific domain of polymers used in electronic packaging.

• DOE Planning & Execution: Plan & conduct Design of Experiments (DOE).

• Experimental Investigation: Identify & investigate different influential factors in experiments setup.

• Material Characterization: Perform materials characterization & evaluation.

• AI Application Exploration: Explore AI application in material development.

• Technical Presentations: Make technical presentations to local & global teams.

  Internship Learning Outcomes:

• Literature Review Skills: Gain proficiency in conducting comprehensive literature reviews.

• DOE Planning: Acquire experience in designing and executing DOE plans.

• Technical Presentation Skills: Enhance ability to deliver effective technical presentations.

• Materials Science Knowledge: Deepen understanding of polymer materials for electronic packaging.

• Experimental Design Competence: Develop skills in identifying and investigating influential factors in experimental setups.

• Material Characterization Techniques: Learn advanced techniques for materials characterization and evaluation.

Your profile
Qualifications and skills to help you succeed 

• Educational Background: On track to attain a Bachelor’s/Master’s degree in Computer Science/Computer Engineering/Electrical & Electronic/Material Science/Chemical Engineering.
• Software Proficiency: Familiar with basic software skills, e.g., MATLAB and Python.
• Passion for Innovation: Passionate about innovation and new technologies.
• Team Collaboration: Strong team player with effective communication skills.
• Independence & Initiative: Able to work under minimum supervision and take initiative
• Preferred intake: Dec 26 - May 27

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. 

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Hillary Woo

https://www.linkedin.com/in/hillary-woo/