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ISP Program Manager

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Onsite

ISP Program Manager

Tata Electronics

ISP Program Manager

Skills

Change ManagementSupply ChainComplianceRisk Management

1 month ago

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Important information


Contract type:

Permanent

Location:

Mayang, Assam 782411, India

Work mode:

Onsite

Published on:

7 September 2026

What they need


Role Overview The Program Manager – OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution—integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment.

Key Responsibilities Program Leadership & Execution

  • Own end-to-end execution of multiple customer programs within the OSAT business unit.
  • Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance).
  • Develop and maintain integrated program schedules, milestones, and deliverables.
  • Drive structured program governance: stage gates, risk reviews, and executive reporting.
  • Manage program financials including cost optimisation models, margins, and change management.

Customer Engagement

  • Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance.
  • Translate customer requirements into actionable internal plans.
  • Manage customer escalations and ensure rapid issue resolution.
  • Support commercial teams in RFQs, SOWs, and new business opportunities.

Operations Readiness & NPI

  • Lead NPI to HVM transition activities including:

  • Factory readiness (equipment, capacity, tooling, materials)

  • Qualification planning (DOE, reliability, process validation)

  • Yield ramp strategies and learning cycles

  • Coordinate process development, product engineering, and manufacturing teams.

  • Ensure BOM, process flows, test programs, and quality controls are production-ready.

Cross-Functional Coordination

  • Chair core team meetings and drive accountability across functions.
  • Manage risk registers, mitigation plans, and contingency strategies.
  • Partner with Industrial Engineering on line design, cycle time, and capacity modeling.
  • Align with Quality on customer qualifications, audits, and compliance.

Continuous Improvement

  • Establish program management best practices, KPIs, and dashboards.
  • Drive lessons-learned and standardization across programs.
  • Support digitalization of program tracking and factory execution.

Required Qualifications- Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.

  • 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging.

  • Relevant years of experience in program/project management with direct customer ownership.

  • Proven experience with:

  • New Product Introduction (NPI) and HVM ramp

  • Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.)

  • Semiconductor quality systems (APQP, FMEA, Control Plans, 8D)

  • Strong knowledge of:

  • Manufacturing operations, capacity planning, and yield management

  • Supply chain coordination and material readiness

  • Cost modeling and program financial management

  • Excellent stakeholder management and communication skills.

  • Ability to influence cross-functional teams without direct authority.

Preferred Qualifications- Master’s degree in Engineering, Operations, or MBA.

  • Experience working directly in an OSAT or IDM ATM environment.

  • PMP / PgMP / PRINCE2 certification.

  • Hands-on background in:

  • Package development and reliability qualification

  • Test engineering and product bring-up

  • Factory automation and MES systems

  • Experience with Tier-1 global customers in mobile, automotive, HPC, or networking.

  • Six Sigma Green/Black Belt certification.

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