Junior Wire Bond Process Engineer

We are looking for a talented Wire Bond Process Engineer to join our team. The ideal candidate will play a critical role in developing and sustaining processes for our manufacturing operations, focusing on quality, efficiency, and innovation.

Key Responsibilities

• Provide technical support and troubleshooting for wire bond manufacturing processes.
• Monitor and improve process yield, quality, productivity, and equipment performance.
• Support process development, qualification, and continuous improvement initiatives.
• Analyze process issues and implement corrective and preventive actions.
• Ensure compliance with customer specifications and quality standards.
• Develop and update process documentation, specifications, and operating procedures.
• Participate in cost reduction, quality improvement, and productivity enhancement projects.
• Work closely with cross-functional teams to achieve operational objectives.

Requirements

• Bachelor's Degree in Engineering or related field.
• Fresh graduates are encouraged to apply.
• Strong analytical and problem-solving skills.
• Good communication and teamwork abilities.
• Knowledge of semiconductor manufacturing processes is an added advantage.
• Willing to work in Ipoh, Perak.