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Laser Engineer

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Onsite

Laser Engineer

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD.

Laser Engineer

2 months ago

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Important information


Contract type:

Permanent

Salary:

MYR 48,000 – MYR 66,000 / year

Location:

Johor Bahru, Johor, Malaysia

Work mode:

Onsite

Published on:

20 August 2026

What they need


About the role

We are seeking a skilled Laser Process Engineer to develop and optimize laser marking, cutting, and trenching processes for advanced semiconductor products. This role offers the opportunity to support new product introduction, improve production yield, and establish robust laser process standards.

Key responsibilities

  • Develop laser marking, cutting, and trenching programs to meet dimensional, cosmetic, manufacturability, and reliability requirements.
  • Define laser paths, energy parameters, and positioning methods for serial numbers, logos, text, and other product markings.
  • Prepare detailed routing logic, process instructions, specifications, inspection standards, and checklists.
  • Optimize laser process designs based on feedback from engineering, production, and quality teams.
  • Troubleshoot production defects, including penetration, residue, delamination, misalignment, and inconsistent marking.
  • Work closely with automation and production teams to conduct trials, validate processes, and support mass-production implementation.
  • Lead root-cause analysis, corrective actions, and continuous improvement activities to increase process stability and product yield.
  • Participate in customer technical discussions and evaluate the suitability, advantages, and limitations of different laser technologies.
  • Establish process risk-assessment mechanisms and continuously strengthen process standardization.

About you

  • Diploma or bachelor's degree in Mechanical, Electrical, Electronics, Mechatronics, Materials Engineering, or a related discipline.
  • At least 3 years of relevant laser process or semiconductor manufacturing experience.
  • Practical knowledge of laser marking, cutting, trenching, programming, parameter optimization, and process validation.
  • Experience in semiconductor packaging, SiP, SMT, PCB, or precision manufacturing is preferred.
  • Strong problem-solving skills with experience handling laser-related defects and yield improvement.
  • Familiarity with DOE, PFMEA, SPC, control plans, and root-cause analysis tools is an advantage.
  • Able to work effectively with customers and cross-functional teams.
  • Good communication skills in English; Mandarin proficiency is an added advantage.

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