Lead Board Design Engineer (X86 processors)

Job Summary

Join AMD as a Hardware Development Engineer within the AECG-FPD-BOARD-BLR (Board Design team, AMD). In this role, you will lead the development and delivery of next-generation embedded computing system boards from concept through production. You will work closely with silicon architects, platform engineers, ODM partners, validation teams, firmware teams, and manufacturing organizations to ensure successful execution of complex embedded hardware programs.

Responsibilities

• Lead hardware development and technical execution of AMD embedded platform programs.
• Drive schematic reviews, board architecture reviews, and design signoff activities.
• Collaborate with different teams on schematic capture, PCB design, manufacturing readiness, and product delivery.
• Define and review high-speed PCB layout guidelines for DDR, PCIe, Ethernet, USB, storage, management interfaces, and power delivery networks.
• Provide technical leadership during board bring-up, validation, root-cause analysis, and issue resolution.
• Review and approve component selection, BOM, risk assessments, and design changes.
• Partner with SI/PI engineers to ensure signal integrity, power integrity, and timing requirements are met.
• Work with firmware, software, validation, and manufacturing teams to ensure successful platform integration.
• Drive DFM, DFT, reliability, compliance, safety, and quality requirements throughout the product lifecycle.
• Manage technical interactions with suppliers and external partners to support schedule, quality, and cost objectives.
• Mentor engineers and contribute to hardware design best practices across the organization.

Preferred Experience

• 13+ yrs of experience in server, networking, industrial control, telecommunications, edge computing, aerospace, automotive, or enterprise hardware development.
• Bachelors or Masters Degree in Electrical/Electronics Engineering.
• Strong knowledge of processor architectures, DDR memory subsystems, PCIe, Ethernet, USB, storage interfaces, and embedded power architectures.
• Expertise in high-layer-count PCB design and high-speed routing methodologies.
• Strong schematic review and board-level debugging skills.
• Experience with SI/PI analysis and interpretation of simulation results.
• Deep understanding of embedded board bring-up, validation, reliability testing, and failure analysis.
• Experience working with ODM/JDM design partners and contract manufacturers.
• Knowledge of safety, regulatory compliance, reliability, and manufacturing requirements.
• Strong project leadership, technical communication, and stakeholder management skills.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.