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Lead Engineer , Manufacturing Process

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Onsite

Lead Engineer , Manufacturing Process

Celestica Electronics (M) Sdn Bhd

Lead Engineer , Manufacturing Process

Skills

GitSAP ERP

2 months ago

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Important information


Contract type:

Permanent

Location:

Johor Bahru, Johor, Malaysia

Work mode:

Onsite

Published on:

19 August 2026

What they need


About the role

Lead Engineer, Manufacturing Process role focused on PCB Assembly operations. The position involves optimizing production data, managing manufacturing processes, and overseeing new product launches while collaborating with cross-functional teams to ensure efficient and high-quality output.

Key responsibilities

  • Prepare and optimize production data for PCB Assembly, ensuring efficient and high-quality output
  • Create and maintain detailed production routings in SAP and Spectrum Pro (SP2), optimizing the material and product flow
  • Develop clear and concise PCB assembly instructions, considering the requirements and capabilities of the production
  • Manage stencil optimization and inventory, ensuring timely delivery and optimal use
  • Oversee the launch of new products, creating all necessary documentation and coordinating with cross-functional teams
  • Manage product changes and version control, ensuring all relevant parties are informed
  • Collaborate closely with production and product development teams, providing technical expertise and support
  • Prepare NPI for new models and Design for Manufacturing (DFM)
  • Prevent and eliminate process defects and maintain quality levels
  • Design and fabricate jig and fixtures and register into system

About you

  • Degree in Electrical/Electronics/Mechanical Engineering
  • 8-10 years of working experience in EMS environment
  • Trained and understand ISO working procedures
  • Familiar with engineering documentation BOM/ECN implementation
  • In-depth knowledge and understanding of the design process for systems and printed circuit boards, subassemblies, or other related company products
  • In-depth knowledge of manufacturing processes and equipment used for systems and printed circuit boards and subassemblies
  • In-depth knowledge of industry and quality standards and SPC methodologies
  • In-depth knowledge of materials and components used in the construction of systems and printed circuit boards and subassemblies
  • 3-5 years people management skills with systematic job load assignments to subordinates

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