Lead Engineer, Package Development

About the role

The Lead Engineer for Package Development is an experienced professional who takes a leading role in bringing new products from design to production. This role is responsible for defining test strategies, leading validation efforts, and driving yield improvement for complex products. Operating with a high degree of autonomy, the Lead Engineer for Package Development is a key contributor to on-time product release and profitability.

Key responsibilities

• Recommend alternative materials to reduce costs, enhance quality, and improve manufacturability
• Support on material characterization and execute appropriate analysis (Destructive Package Analysis, Failure Analysis, Product Characterization) to aid in the design and/or resolution of issues for new packaging projects
• Conceive, source out and test alternative and new methods/processes to improve manufacturability, yield, and quality
• Spearhead generation of FMEA for new Assembly processes and review until completion of qualification
• Design and/or qualify jigs, fixtures, and tools to enhance machine efficiency and improve product quality
• Generate and/or review equipment specifications and qualification procedures and supporting documents for PAR of new equipment
• Spearhead machine qualification and monitoring, and/or conduct equipment buy-off at supplier site
• Determine machine and process capability for new products
• Plan, design, implement and monitor activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects
• Generate, interpret, and update process and material specifications and flowcharts for new package projects

About you

• Degree in Mechanical/Electrical/Electronics and Communication/Materials/Metallurgical/Chemical/Manufacturing/Industrial Engineering
• At least 5 years' experience in a Package Development, New Product Introduction and/or Sustaining role in a semiconductor assembly environment for leadframe and substrate-based packages
• Subject matter expert with comprehensive knowledge of failure modes and failure analysis, covering standard and custom package
• Ability to comprehensively perform, review and interpret mold simulations and create/recommend effective solutions
• Ability to review and interpret POD and tooling designs and create/recommend effective solutions to achieve design intent
• Comprehensive knowledge of downstream and upstream Assembly processes that impact the Molding Processes
• Comprehensive or SME level knowledge on FA/Rel Assessment instruments namely CSAM, Cross Section, SEM and similar methods/tools
• Subject matter expert in the use of statistical methods of experimentation and analysis and their associated application/tools (DOE, SAS-JMP, Minitab, others)
• High level of effective written, oral communication, presentation, and training skills
• Experience in handling, supervising a technical team and possesses good people skills