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Lead High-Speed PCB Layout Engineer

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Onsite

Lead High-Speed PCB Layout Engineer

Array Labs

Lead High-Speed PCB Layout Engineer

2 months ago

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Important information


Contract type:

Permanent

Salary:

$160,000 – $200,000 / year

Location:

Redwood City, CA, USA

Work mode:

Onsite

Published on:

23 August 2026

What they need


  • As a Lead High-Speed PCB Layout Engineer, you will own the physical implementation of Array’s high-speed digital and mixed-signal electronics in Altium, translating schematics and performance requirements into layouts and functional designs
  • Your work will include component placement, constraint-driven routing, stack-up definition, return path and reference plane strategy, and partitioning between sensitive mixed-signal domains and high-speed digital interfaces
  • You will partner closely with electrical design, firmware, mechanical, and test engineers to drive layout constraints, reviews, and manufacturing releases
  • The boards you ship will directly determine signal integrity, power integrity, noise performance, and overall system reliability in the lab and on orbit
  • Own high-speed PCB layout from initial placement through manufacturing release in Altium
  • Define and implement stack-ups, impedance targets, length-matching constraints, and reference plane/return-path strategies for high-speed interfaces
  • Translate schematic intent into layouts that meet signal integrity and power integrity requirements across mixed-signal and digital domains
  • Partner with electrical design, firmware, mechanical, and test engineers to develop layout constraints, run reviews, and de-risk first-pass success
  • Drive DFM/DFT considerations with fabrication and assembly partners, including documentation and release artifacts- High levels of self-motivation and personal accountability
  • Ability to work in a fast-paced environment under significant time constraints
  • B.S. in Electrical Engineering, or a related field with 8+ years of relevant experience
  • Experience in PCB layout, fabrication, and release of high-speed digital and mixed-signal electronics
  • Excellent teamwork and communication skills
  • Learns new concepts rapidly, completely, and in a self-directed manner
  • Experience designing high-speed digital and mixed-signal PCB layouts including constraint-driven routing, impedance control, and length matching
  • Experience developing PCB stack-ups and layout constraints for high-speed interfaces and dense, high-performance boards
  • Comfort with Altium Designer for complex layout and clean manufacturing outputs; familiarity with Allegro and/or OrCAD
  • A strong intuition for layout-driven SI/PI behavior, including return paths, reference plane strategy, via transitions, and noise coupling between domains
  • Experience working closely with electrical design engineers to translate schematic intent into layouts that work on the first spin
  • Experience with manufacturing release, DFM/DFT considerations, and collaborating with fabrication and assembly partners
  • Familiarity with SI/PI analysis workflows and tools such as Ansys SIwave, Keysight Power Analyzer, HyperLynx, or Sigrity
  • Experience supporting lab bring-up and debug alongside design and test engineers, including investigating SI/PI issues observed on hardware
  • Experience taking high-performance hardware from prototype through qualification and environmental testing
  • To conform to U.S. Government space technology export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State- We will conduct interviews via Google Meet; the typical process takes around 2-4 weeks to complete from start to finish

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