TYLsemi

About The Role
As our Lead Performance architect, you'll drive the architectural configuration, system-level simulation, and PPA optimization of the chiplet by using industry-standard ESL tools and / or developing in-house tools to integrate and calibrate highspeed I/O IPs such as PCIe, UCIe and Ethernet as well as NoC fabric into a system. You'll own the trade-off analysis that define what we tape out.
Responsibilities
<ul>
<li>Own PPA exploration and trade-offs between peak performance, silicon area, and thermal/power budgets, and turn that into clear tape-out recommendations.</li>
<li>Build transaction-level models (TLM) using commercial ESL suites (e.g. Platform Architect) that integrate third-party IPs such as PCIe, UCIe, and NoC etc into a full-chiplet model.</li>
<li>Define, sweep, and validate hardware configuration parameters — buffer sizes, queue depths, clock-domain crossings, routing tables — to maximize throughput and minimize latency across realistic workloads.</li>
<li>Characterize traffic across the internal NoC and the UCIe die-to-die interface to find congestion points and rule out protocol deadlocks before they reach silicon.</li>
<li>Work directly with our IP vendors to debug model/behavioral mismatches, report performance anomalies, and integrate new IP deliverables as they land.</li>
</ul>
Required
<ul>
<li>BS/MS in Electrical Engineering or related field with 6+ years in computer architecture, performance modeling, or microarchitecture configuration.</li>
<li>Direct, hands-on experience with commercial ESL tools such as Platform Architect, Virtualizer, or comparable frameworks.</li>
<li>Solid working knowledge of at least one of: PCIe (Gen 5/6/7), UCIe, or AMBA NoC protocols (AXI/CHI) — and a willingness to get deep on the others.</li>
<li>Strong Python for automating large-scale simulation sweeps, parsing performance reports, and analyzing results.</li>
<li>Familiarity with SystemC and transaction-level modeling paradigms — enough to write custom traffic generators when the off-the-shelf models fall short.</li>
</ul>
Nice to have
<ul>
<li>Fluency with power modeling or floor-planning trade-offs.</li>
<li>Prior work on a multi-die / chiplet program, or hands-on UCIe die-to-die.</li>
<li>Experience taking architectural models through to a real tape-out.</li>
</ul>
About TYLsemi, Inc.
The Opportunity
The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem:
how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?
That's what we solve. TYLsemi builds the
chiplet infrastructure IP
— the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.
This isn't a nice-to-have. It's the critical path.
Why Now
The Market Window
The semiconductor industry is going through its biggest architectural shift in 40 years:
<ul>
<li>Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.</li>
<li>Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI — they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually.</li>
<li>IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.</li>
<li>Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing.</li>
</ul>
Culture &amp; Team: How We Work
No Politics, No Bureaucracy
There are no layers, no approval chains, no corporate theater.
<ul>
<li>If you have an idea, we test it. If it works, we ship it.</li>
<li>No endless meetings, no PowerPoint presentations to convince middle management.</li>
</ul>
Remote-Friendly, Global Team
<ul>
<li>US team: Bay Area preferred, but we hire the best people regardless of location</li>
<li>India team: Building a world-class design center in Bangalore</li>
</ul>
Move Fast, Ship Real Products
We're not a research project. We have paying customers, committed capital, and aggressive timelines.
This is a company, not a lifestyle business. We're building to win.
What We Value
<ul>
<li>Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it.</li>
<li>Bias for action. We move fast. Analysis paralysis doesn't fly here.</li>
<li>Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware.</li>
<li>Low ego, high standards. We don't care about titles or politics. We care about results.</li>
</ul>
The Ask
If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.
We're asking you to walk away from that and bet on us.
Here's Why You Should
<ul>
<li>The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building.</li>
<li>The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo.</li>
<li>The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.</li>
<li>The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI.</li>
</ul>
This is the bet.
Join us and build something that matters.
Or stay comfortable. No judgment.
But if you're the kind of person who wants to take the shot, we'd love to talk.
READY TO JOIN?
The Pay Range For This Role Is
204,000 - 250,000 USD per year (US)

Lead SoC Performance & Power Engineer

Lead SoC Performance & Power Engineer

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