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Litho Process Manager

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Onsite

Litho Process Manager

Tata Electronics (TEPL)

Litho Process Manager

Skills

NodeData AnalysisSupply ChainCompliance

2 months ago

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Important information


Contract type:

Permanent

Location:

Ahmedabad, Gujarat, India

Work mode:

Onsite

Published on:

3 September 2026

What they need


Job Summary

The selected candidate will lead lithography process, mask engineering, and metrology activities to support technology development, yield enhancement, process stability, and high-volume manufacturing at Tata Semiconductor Manufacturing Pvt Ltd. The role is responsible for defining lithography and mask strategy, driving process innovation, ensuring world-class overlay/CDU performance, and leading cross-functional teams through technology transfer, process optimization, and manufacturing excellence initiatives.

The position requires strong expertise in scanner lithography, mask engineering, process control, yield improvement, defect reduction, and advanced process integration across multiple technology nodes.

Key Responsibility

  1. Define and execute the lithography and mask engineering roadmap aligned with technology, manufacturing, and business objectives.

  2. Lead process development, qualification, optimization, and sustaining activities for scanner, track, mask, and metrology systems.

  3. Establish and drive strategic targets forcriticaldimensionuniformity (CDU), overlay, defectivity, focus control, and process capability.

  4. Own mask lifecycle management including mask qualification, inspection, defect control, cleaning strategy, repair coordination, and mask health monitoring.

  5. Drive yield improvement initiatives through process characterization, defect reduction, process window optimization, and root cause analysis.

  6. Lead evaluation and implementation of next-generation lithography technologies, equipment, materials, and process solutions.

  7. Collaborate with Process Integration, Etch, CMP, Yield Enhancement, Product Engineering, Manufacturing, Quality, and Equipment Engineering teams to resolve complex technical issues.

  8. Drive advanced process control initiatives using SPC, APC, FDC, tool matching, automation, and data analytics methodologies.

  9. Support technology transfer, NPI programs, production ramp-up, and high-volume manufacturing readiness.

  10. Define standards for process control plans, SOPs, OCAPs, recipe management, and best practices across lithography and mask operations.

  11. Lead technical reviews, supplier engagements, audits, customer interactions, and RD collaborations.

  12. Mentor and develop engineers, build organizational capability, and establish a culture of innovation, operational excellence, and continuous learning.

  13. Drive strategic projects leading to yield improvement, cycle-time reduction, cost optimization, and productivity enhancement.

  14. Promote innovation through patents, technical publications, benchmarking activities, and implementation of emerging semiconductor technologies.

  15. Ensure compliance with EHS, quality systems, and semiconductor manufacturing standards.

Qualification

  • Bachelor''s, Master''s, or PhD in Electrical Engineering, Electronics Engineering, Materials Science, Physics, Chemical Engineering, Semiconductor Technology, or related disciplines.

  • 8+ years of relevant semiconductor industry experiencein Lithography Process Engineering, Mask Engineering, Lithography Metrology, or Advanced Process Development.

  • Experience in semiconductor foundry, logic, memory,analog, mixed-signal, or specialty technology manufacturing environments.

  • Prior experience leading engineering teams or major cross-functional technical projects is highly desirable.

Leadership Competencies

  • Strong people leadership and team development capabilities.

  • Ability to influence stakeholders across engineering, manufacturing, supply chain, and executive leadership.

  • Excellent project management, communication, and presentation skills.

  • Strong decision-making ability in a dynamic high-volume manufacturing environment.

  • Customer-focused mindset with a commitment to quality, safety, and operational excellence.

Experience

  • Experiencedwith12ASML, Nikon, Canon scanners and TEL track platforms.

  • Exposure to advanced node technology development and production ramp.

  • Experience in semiconductor foundry operations and technology transfer programs.

  • Patent filings, technical publications, or industry conference presentations will be an added advantage.

Technical Requirements

  • Strong expertise in photolithography processes including i-Line, KrF, ArF Dry, and ArF Immersion technologies.

  • Deep understanding of scanner optics, imaging performance, process windows, CDU, overlay, focus, and defect control.

  • Strong knowledge of mask engineering,reticlemanagement, inspection, defect review, cleaning, repair, and mask lifecycle management.

  • Experience with OPC, RET methodologies, alignment strategies, overlay marks, CD targets, and process integration requirements.

  • Proficiency in advanced statistical analysis and process control using JMP, SPC, APC, DOE, Minitab, 5D Analyzer, and Yield Management tools.

  • Experience in tool qualification, process matching, equipment characterization, and technology transfer.

  • Strong problem-solving skills utilizing 8D, FMEA, Fishbone Analysis, DOE, and 5 Why methodologies.

  • Knowledge of semiconductor manufacturing systems, MES, automation, and Industry 4.0 initiatives.

Job Summary

The selected candidate will lead lithography process, mask engineering, and metrology activities to support technology development, yield enhancement, process stability, and high-volume manufacturing at Tata Semiconductor Manufacturing Pvt Ltd. The role is responsible for defining lithography and mask strategy, driving process innovation, ensuring world-class overlay/CDU performance, and leading cross-functional teams through technology transfer, process optimization, and manufacturing excellence initiatives.

The position requires strong expertise in scanner lithography, mask engineering, process control, yield improvement, defect reduction, and advanced process integration across multiple technology nodes.

Key Responsibility

  1. Define and execute the lithography and mask engineering roadmap aligned with technology, manufacturing, and business objectives.

  2. Lead process development, qualification, optimization, and sustaining activities for scanner, track, mask, and metrology systems.

  3. Establish and drive strategic targets forcriticaldimensionuniformity (CDU), overlay, defectivity, focus control, and process capability.

  4. Own mask lifecycle management including mask qualification, inspection, defect control, cleaning strategy, repair coordination, and mask health monitoring.

  5. Drive yield improvement initiatives through process characterization, defect reduction, process window optimization, and root cause analysis.

  6. Lead evaluation and implementation of next-generation lithography technologies, equipment, materials, and process solutions.

  7. Collaborate with Process Integration, Etch, CMP, Yield Enhancement, Product Engineering, Manufacturing, Quality, and Equipment Engineering teams to resolve complex technical issues.

  8. Drive advanced process control initiatives using SPC, APC, FDC, tool matching, automation, and data analytics methodologies.

  9. Support technology transfer, NPI programs, production ramp-up, and high-volume manufacturing readiness.

  10. Define standards for process control plans, SOPs, OCAPs, recipe management, and best practices across lithography and mask operations.

  11. Lead technical reviews, supplier engagements, audits, customer interactions, and RD collaborations.

  12. Mentor and develop engineers, build organizational capability, and establish a culture of innovation, operational excellence, and continuous learning.

  13. Drive strategic projects leading to yield improvement, cycle-time reduction, cost optimization, and productivity enhancement.

  14. Promote innovation through patents, technical publications, benchmarking activities, and implementation of emerging semiconductor technologies.

  15. Ensure compliance with EHS, quality systems, and semiconductor manufacturing standards.

Qualification

  • Bachelor''s, Master''s, or PhD in Electrical Engineering, Electronics Engineering, Materials Science, Physics, Chemical Engineering, Semiconductor Technology, or related disciplines.

  • 8+ years of relevant semiconductor industry experiencein Lithography Process Engineering, Mask Engineering, Lithography Metrology, or Advanced Process Development.

  • Experience in semiconductor foundry, logic, memory,analog, mixed-signal, or specialty technology manufacturing environments.

  • Prior experience leading engineering teams or major cross-functional technical projects is highly desirable.

Leadership Competencies

  • Strong people leadership and team development capabilities.

  • Ability to influence stakeholders across engineering, manufacturing, supply chain, and executive leadership.

  • Excellent project management, communication, and presentation skills.

  • Strong decision-making ability in a dynamic high-volume manufacturing environment.

  • Customer-focused mindset with a commitment to quality, safety, and operational excellence.

Experience

  • Experiencedwith12ASML, Nikon, Canon scanners and TEL track platforms.

  • Exposure to advanced node technology development and production ramp.

  • Experience in semiconductor foundry operations and technology transfer programs.

  • Patent filings, technical publications, or industry conference presentations will be an added advantage.

Technical Requirements

  • Strong expertise in photolithography processes including i-Line, KrF, ArF Dry, and ArF Immersion technologies.

  • Deep understanding of scanner optics, imaging performance, process windows, CDU, overlay, focus, and defect control.

  • Strong knowledge of mask engineering,reticlemanagement, inspection, defect review, cleaning, repair, and mask lifecycle management.

  • Experience with OPC, RET methodologies, alignment strategies, overlay marks, CD targets, and process integration requirements.

  • Proficiency in advanced statistical analysis and process control using JMP, SPC, APC, DOE, Minitab, 5D Analyzer, and Yield Management tools.

  • Experience in tool qualification, process matching, equipment characterization, and technology transfer.

  • Strong problem-solving skills utilizing 8D, FMEA, Fishbone Analysis, DOE, and 5 Why methodologies.

  • Knowledge of semiconductor manufacturing systems, MES, automation, and Industry 4.0 initiatives.

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