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M00510 新製程整合工程師

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Onsite

M00510 新製程整合工程師

WNC Corporation

M00510 新製程整合工程師

Skills

Testing & QAWorkdayProcess Improvement

1 month ago

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Important information


Contract type:

Permanent

Location:

Taiwan

Work mode:

Onsite

Published on:

29 September 2026

What they need


We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude.

Job Description

  1. SiP Process Development and Optimization:
  • Design and implement SiP processes to ensure process stability and efficiency.
  • Adjust and optimize process parameters to improve product yield.
  1. Process Issue Identification and Resolution:
  • Identify and resolve typical or related issues that may arise in the process through existing procedures.
  • Evaluate and select solutions to ensure effective resolution of process issues.
  1. Process Technical Documentation:
  • Write process technical documents to ensure traceability and standardization of process flows.
  • Update process documents to reflect the latest process improvements and optimizations.
  1. Process Quality Assurance:
  • Complete tasks according to established operating procedures to ensure process quality meets specification requirements.
  • Conduct process quality inspections to ensure products meet internal and customer quality standards.
  1. Cross-Departmental Collaboration:
  • Collaborate with design, manufacturing, and quality assurance teams to participate in requirements discussions and feasibility assessments.
  • Provide technical support to ensure rapid resolution of process issues.

Education

Work Experience

Language

Skills

Complexity Reduction、 Defects Per Million Opportunities、 Documentation Generation、 Failure Analysis、 ISO 9000、 Manufacturing Execution Systems (MES)、 Material Balance Planning、 Process Analytical Technology (PAT)、 Process Development (PD)、 Process Flow Diagram (PFD)、 Process Manufacturing、 Process Simulation、 Process Specification、 Process Validation、 Semiconductor Device Fabrication、 Semiconductor Package、 Wafer Probing

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