MAINTENANCE TECHNICIAN (DIE BOND/WIRE BOND/ENCAPSULATION/TEST PROCESS)

Responsibilities :

• Carry out routine tasks of a planned maintenance course such as undertaking simple servicing, adjustments and alignments of mechanical elements.
• Install and adjust mechanical, pneumatic, hydraulic, electrical and electronic machines or parts of machines.
• Fabricate simple machine parts using conventional precision engineering machines, hand tools and assembly processes.
• Mount and secure different types of electrical motors, sensors and switches onto assemblies and sub-assemblies.
• Diagnose faults using test equipment for electrical, electronic, pneumatic and hydraulic systems including.
• Perform simple integration, installation, calibration, maintenance, commissioning, documentation and troubleshooting of automated production equipment.
• To set the machine parameter as per specification.

Requirements :

• Candidate must possess at least a Diploma in Electronics Engineering, Mechanical Engineering or equivalent.
• Minimum 1 year working experience in semiconductor industry.
• Fresh Diploma Graduates are encouraged to apply.

Job type : Full-time, Permanent

Job Type: Full-time

Pay: RM1,800.00 - RM3,000.00 per month

Benefits:

• Gym membership
• Health insurance
• Maternity leave
• Parental leave

Education:

• Diploma/Advanced Diploma (Preferred)

Experience:

• Technician: 1 year (Preferred)

Work Location: In person