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Manager/Senior Manager, Technology-Business Development (Advanced Packaging), IME

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Onsite

Manager/Senior Manager, Technology-Business Development (Advanced Packaging), IME

A*STAR - Agency for Science, Technology and Research

Manager/Senior Manager, Technology-Business Development (Advanced Packaging), IME

Skills

AIBusiness Development

2 months ago

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Important information


Contract type:

Permanent

Location:

Singapore

Work mode:

Onsite

Published on:

7 September 2026

What they need


Core Responsibilities

Customer Engagement & Solution Development

  • Engage prospective customers to understand their technology roadmaps, packaging challenges and development needs.
  • Position tailored solutions leveraging IME's Advanced Packaging capabilities, technology platforms and process expertise.
  • Build and maintain a sizable pipeline of customer opportunities and industry-funded projects.
  • Translate complex technology capabilities into clear customer value and business benefits.

Technology & Market Analysis

  • Monitor emerging technologies and market trends in Advanced Packaging, heterogeneous integration, chiplets, 2.5D/3D integration, hybrid bonding and Co-Packaged Optics (CPO).
  • Assess market demand and technology adoption for next-generation packaging solutions.
  • Identify new opportunities and application areas, including AI computing, high-performance computing and data center applications.

Strategic Partnership & Business Development

  • Identify and develop partnerships with semiconductor companies, foundries, OSATs, equipment and material suppliers, and ecosystem partners.
  • Develop joint development programmes, industry collaborations and customer projects.
  • Evaluate business cases for new research programmes and technology platforms.
  • Work closely with the Technology Development Team to align technology priorities with customer and market needs.

Key Skills And Experience Education: Degree in Electronics/Electrical Engineering or equivalent.

Technical Background: Good understanding of semiconductor technology, particularly semiconductor back-end processes and Advanced Packaging. Knowledge of heterogeneous integration, chiplets, 2.5D/3D packaging, hybrid bonding or CPO will be an advantage.

Business Acumen: Ability to understand market trends, identify customer opportunities, build a strong project pipeline and develop successful business cases.

Communication: Strong presentation, interpersonal and stakeholder management skills, with the ability to communicate effectively with both technical and business audiences.

Strategic Thinking: Ability to understand how emerging Advanced Packaging technologies and market trends can create long-term business and technology opportunities.

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