Manufacturing Engineer

Job Summary

Chipstone Electronics is setting up and ramping a module-packaging production facility in Singapore.

We are looking for a hands-on and technically competent Manufacturing / Process Engineer to support our semiconductor assembly and packaging operations. The successful candidate will be responsible for machine troubleshooting, process improvement, equipment performance, and production support to ensure smooth, stable, and efficient manufacturing operations.

Candidates with relevant experience in the semiconductor, electronics, or similar manufacturing industries will have an added advantage.

Key Responsibilities

• Perform hands-on machine troubleshooting, fault diagnosis, and recovery to minimize equipment downtime.

• Establish PM standard. Plan and carry out preventive maintenance (PM), corrective maintenance, and equipment performance monitoring.

• Establish and maintain PM schedules, maintenance checklists, machine records, and troubleshooting reports.

• Manage spare parts inventory, monitor spare parts usage, and ensure critical spare parts are available.

• Communicate and coordinate closely with Headquarters (HQ) technical teams to resolve machine, equipment, and process-related issues.

• Support daily production operations, machine setup, process parameter adjustment, and process verification.

• Monitor and improve manufacturing processes, product quality, yield, productivity, and equipment performance.

• Investigate customer quality feedback, perform root cause analysis, and prepare 8D reports with corrective and preventive actions.

• Establish and maintain process documents, SOPs, work instructions, checklists, and other relevant engineering records.

• Support new machine setup, process improvement, and production ramp-up activities.

• Work closely with Production and Quality teams to resolve production and process issues and ensure compliance with quality and safety requirements.

• Perform other engineering-related duties as assigned by Management.

Job Requirements

• Diploma or Degree in Mechanical, Electrical, Mechatronics, Electronics, Manufacturing Engineering, or a related discipline.

• Hands-on experience in machine troubleshooting, preventive maintenance, corrective maintenance, and process engineering is essential.

• Strong practical problem-solving skills with the ability to identify root causes and implement effective solutions.

• Experience in preparing 8D reports, handling customer quality feedback, and implementing corrective and preventive actions.

• Experience in spare parts management, maintenance planning, and engineering documentation.

• Able to communicate effectively with HQ technical teams and coordinate technical problem-solving activities.

• Experience in semiconductor assembly and packaging, electronics manufacturing, or similar industries will be an advantage.

• Knowledge of Die Attach, Wire Bonding, and Encapsulation processes will be an advantage.

• Able to work independently, take ownership of equipment and process issues, and support production requirements.

• Good communication, analytical, documentation, and coordination skills.