Material Engineer (Epoxy Mold Compound / Glue)

Key Responsibilities

In your new role, you will:

• Lead EMC material development, evaluation, qualification, and change projects aligned with package technology roadmaps.
• Assess new EMC materials for package compatibility, processability, reliability, and manufacturability.
• Own and maintain EMC material procurement specifications and related technical documentation.
• Provide technical support for package development, BOM selection, assembly process integration, and production issue resolution.
• Drive root-cause analysis and technical solutions for EMC-related 8D, task force, and global change management activities.
• Collaborate with UPD, TPM, SQM, Procurement, suppliers, and research partners to qualify and commercialize new materials.
• Support supplier audits, material quality reviews, and continuous improvement of EMC material performance.
• Build technical know-how through benchmarking, market scouting, publications, and conference participation.

Requirements

You are best equipped for this role if you have:

• A degree in Chemistry, Materials Science, Polymer Chemistry, or a related discipline; MSc or PhD preferred.
• Minimum 5 years of experience in EMC formulation, material development, or backend semiconductor packaging.
• Strong knowledge of EMC characterization, material analysis, package reliability, and assembly technologies.
• Experience working with EMC suppliers is an advantage.
• Familiarity with failure analysis, simulation tools, and material qualification processes.
• Strong communication, stakeholder management, and cross-functional collaboration skills.
• Proficiency in Microsoft Office, with an interest in using AI tools to improve productivity