ME工程师

• Responsible for daily maintenance, troubleshooting, and preventive maintenance of Die Bonding (DB) and Wire Bonding (WB) equipment, including establishing and maintaining related equipment and process procedures.
• Analyze equipment failures, perform troubleshooting and corrective actions, and develop preventive maintenance plans to improve equipment reliability.
• Work closely with Process Engineers (PE) to optimize Die Bonding and Wire Bonding process parameters and improve product yield.
• Support Process Engineers in New Product Introduction (NPI) activities, including equipment process capability evaluation (CPK) and process readiness assessment.
• Monitor equipment performance and support continuous improvement activities to enhance manufacturing efficiency and stability.
• Ensure equipment maintenance activities comply with company SOPs, safety requirements, and manufacturing standards.
• Provide technical support to production teams and collaborate with cross-functional teams to resolve equipment-related issues.

Job Requirements:

• Bachelor’s degree or above in Mechanical Engineering, Electrical Engineering, Electronics, Mechatronics, Manufacturing Engineering, or related fields.
• Minimum 3 years of relevant experience in Manufacturing Engineering, Equipment Engineering, or a similar role.
• Hands-on experience with Die Bonding and Wire Bonding equipment is highly preferred.
• Experience in semiconductor, optical module, electronics manufacturing, or precision manufacturing industries is an advantage.
• Strong troubleshooting skills and ability to analyze equipment failures.
• Familiarity with equipment maintenance, process optimization, and manufacturing improvement activities.
• Good communication skills and ability to work effectively with production, process, and quality teams.