Mechanical Engineer

A high-profile, globally operating Unicorn and networking technology scale-up engineering next-generation software and hardware platforms for the telecommunications and cloud networking sectors.

Backed by substantial late-stage venture funding (including a major Series C), the company employs hundreds of professionals worldwide with a large R&D center in Israel.

The company delivers high-efficiency network architectures enabling global telecom operators to expand network capacity while significantly reducing operational costs.

Combining enterprise-grade stability with multidisciplinary engineering excellence, the company tackles high-density Data Center hardware, complex mechanical packaging, and advanced thermal management at scale.

Located in the Sharon District, operating on a hybrid model with one day working from home.

Role Description-

• Serving as a Senior Mechanical Engineer (NPI, Thermal & Operations), taking end-to-end mechanical ownership over transitioning complex networking and data center hardware systems from R&D into mass production.
• Leading New Product Introduction (NPI) processes, overseeing Chassis, Racks, and high-density electronic packaging architectures across their full manufacturing lifecycles.
• Designing, analyzing, and optimizing thermal management architectures, specifically focusing on Thermal & Liquid Cooling solutions for high-power, high-density networking and datacenter environments.
• Managing relationships and technical workflows with global contract manufacturers (CMs), suppliers, and sheet-metal/fabrication vendors.
• Resolving manufacturing yield issues on the production line, implementing root-cause failure analyses, and releasing Engineering Change Orders (ECOs) systematically.
• Collaborating closely with Hardware, Operations, Layout, and Systems Engineering squads to ensure seamless design for manufacturability (DFM), assembly (DFA), and thermal compliance.

Requirements-

• B.Sc. in Mechanical Engineering from an accredited university – Mandatory
• 5 years of dedicated professional mechanical engineering experience taking complex electronic/telecom hardware systems through NPI into mass production – Mandatory
• Deep, hands-on expertise in Thermal Management and Liquid Cooling architectures for high-power electronic systems and Data Center racks – Mandatory
• Proven background in electronic packaging, chassis design, and rack-mount system integration – Mandatory
• Extensive experience in Manufacturing & Operations workflows, including vendor qualification, line troubleshooting, and ECO management – Mandatory
• Strong proficiency with modern 3D CAD platforms (e.g., SolidWorks) and thermal simulation tools (e.g., FloTHERM, Icepak, or Ansys) – Mandatory
• Excellent interpersonal, supplier management, and fluent professional communication skills in English (written and verbal) – Mandatory