Metric DCX
Mechanical Engineering
Skills
15 days ago
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Important information
Contract type:
Permanent
Location:
Mutual, OH, USA
Work mode:
Remote
Published on:
6 October 2026
What they need
Mechanical Engineer – Thermal & Liquid Cooling
Location: United States
Industry: AI Infrastructure / Data Centers
We are partnered with a rapidly growing AI infrastructure company building the physical systems required to support next-generation, high-density compute environments.
They are looking for an experienced Mechanical Engineer to join as a senior individual contributor, owning thermal and cooling engineering across both traditional air-cooled and advanced liquid-cooled infrastructure.
The Role:
- Design and develop cooling solutions for high-density AI/data center environments.
- Lead mechanical engineering across both air and liquid cooling systems.
- Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
- Work with CDUs, liquid loops, heat exchangers, pumps, piping and associated thermal infrastructure.
- Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
- Perform thermal analysis, system sizing, equipment selection and design reviews.
- Work closely with electrical, controls, infrastructure and deployment teams.
- Evaluate new cooling technologies as compute densities continue to increase.
- Operate as a highly technical individual contributor with significant ownership over engineering decisions.
Requirements:
- Strong mechanical/thermal engineering background within data centers, HPC, AI infrastructure or similarly high-density environments.
- Direct hands-on experience with Direct-to-Chip liquid cooling is required.
- Strong understanding of both liquid and air cooling technologies.
- Experience designing mechanical cooling systems from concept through deployment.
- Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
- Comfortable operating independently in a fast-moving engineering environment.
This is an opportunity to take significant technical ownership within an early-stage infrastructure business tackling some of the most complex thermal challenges created by next-generation AI compute.
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