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Mechanical Engineering

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Remote

Mechanical Engineering

Metric DCX

Mechanical Engineering

Skills

AI

15 days ago

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Important information


Contract type:

Permanent

Location:

Mutual, OH, USA

Work mode:

Remote

Published on:

6 October 2026

What they need


Mechanical Engineer – Thermal & Liquid Cooling

Location: United States

Industry: AI Infrastructure / Data Centers

We are partnered with a rapidly growing AI infrastructure company building the physical systems required to support next-generation, high-density compute environments.

They are looking for an experienced Mechanical Engineer to join as a senior individual contributor, owning thermal and cooling engineering across both traditional air-cooled and advanced liquid-cooled infrastructure.

The Role:

  • Design and develop cooling solutions for high-density AI/data center environments.
  • Lead mechanical engineering across both air and liquid cooling systems.
  • Develop and optimize Direct-to-Chip (D2C) liquid cooling architectures.
  • Work with CDUs, liquid loops, heat exchangers, pumps, piping and associated thermal infrastructure.
  • Engineer air-side systems including CRAH/CRAC, chilled water and heat rejection systems.
  • Perform thermal analysis, system sizing, equipment selection and design reviews.
  • Work closely with electrical, controls, infrastructure and deployment teams.
  • Evaluate new cooling technologies as compute densities continue to increase.
  • Operate as a highly technical individual contributor with significant ownership over engineering decisions.

Requirements:

  • Strong mechanical/thermal engineering background within data centers, HPC, AI infrastructure or similarly high-density environments.
  • Direct hands-on experience with Direct-to-Chip liquid cooling is required.
  • Strong understanding of both liquid and air cooling technologies.
  • Experience designing mechanical cooling systems from concept through deployment.
  • Knowledge of CDUs, heat exchangers, pumps, piping, chilled water and heat rejection systems.
  • Comfortable operating independently in a fast-moving engineering environment.

This is an opportunity to take significant technical ownership within an early-stage infrastructure business tackling some of the most complex thermal challenges created by next-generation AI compute.

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