MediaTek
Memory Packaging Technical Manager
1 month ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
7 September 2026
What they need
Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM development
Main Requirements and Qualifications
10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus.
- Familiar with memory design, architecture, process, packaging, materials…
- Project handling experience
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