Microelectronics Assembly Technician – Wire Bonding

Or Akiva, Israel

About HighSecLabs (HSL)

HSL (High Security Labs), located in Or Akiva, Israel, is looking for a Microelectronics Assembly Technician – Wire Bonding to join our team.

Requirements

• Previous hands-on experience operating Wire Bonding machines – Required.
• Experience working with microscopes and performing delicate, high-precision tasks.
• Strong attention to detail, accuracy, responsibility, and the ability to work independently.
• Familiarity with microelectronics manufacturing or electronic assembly processes – Advantage.
• Experience working in a cleanroom environment – Advantage.
• Experience in the defense industry – Advantage.

Key Responsibilities

• Perform high-precision Wire Bonding processes.
• Set up Wire Bonding equipment and switch production programs according to manufacturing requirements.
• Work with microscopes and perform visual inspections to ensure product quality.
• Identify basic equipment or process issues and report them to the relevant teams.
• Document production processes and complete manufacturing reports.
• Follow quality assurance, safety, and manufacturing procedures.
• Collaborate closely with Production, Engineering, and Quality teams.

This position is open to all qualified candidates.