Modeling Engineer

About the Company

Saras Micro Devices is a fully funded start-up company developing innovative power delivery solutions enabling further advancements and market adoption of high-performance computing, AI, virtual reality, 5G and more. Saras is developing this pioneering technology in partnership with industry-leading Fortune 500 companies and other innovative computing solution providers to support best-in-class, energy-efficient products. Our vision is to change the performance-to-power paradigm for next generation computing solutions through heterogeneously integrated Saras Micro Devices products. We look forward to talking with smart, energetic, team-oriented professionals who can grow with us. We provide competitive salary and benefit plans, and some of the best co-workers you’ll find anywhere. Our Values: Teamwork, Execution, Accountability, Recognition, Respect.

About the Role

Are you a talented Modeling Engineer looking for a new challenge and an opportunity to advance your skills and your career in a great working environment? We have the perfect job for you! Saras Micro Devices is seeking a highly proactive and skilled Modeling Engineer that is responsible for developing, validating, and deploying thermo-mechanical, electrical, and multi-physics simulation models that support the design, development, qualification, and optimization of advanced electronic components.

Responsibilities:

• Thermo-Mechanical Modeling
• Develop and execute FEA simulations to predict:
• Component and substrate warpage
• Thermo-mechanical stress and strain
• CTE mismatch behavior
• Delamination risk
• Interconnect and via reliability
• Mechanical fatigue life
• Moisture-induced failures
• Reflow-induced deformation
• Model reliability performance under:
• Temperature cycling
• Thermal shock
• HAST/uHAST/bHAST exposure
• High temperature storage
• Vibration and mechanical shock
• Correlate simulation results with experimental and reliability test data.
• Electrical Modeling
• Develop electrical and electromagnetic models to predict:
• Capacitance
• ESR
• ESL
• Impedance
• Resonance behavior
• S-parameters
• Power delivery network performance
• Support de-embedding methodologies for electrical characterization.
• Develop equivalent circuit models for embedded passive devices and package structures.
• Support signal integrity and power integrity analysis. (SI wave)
• Model Development & Validation
• Build physics-based predictive models.
• Establish model correlation plans.
• Compare simulation results to measured data.
• Improve model accuracy through calibration, tuning and validation activities.
• Generate simulation methodologies, best practices, and standards.
• Product Development Support
• Support technology down-selection and design decisions.
• Provide simulation-driven recommendations to engineering teams.
• Participate in DFMEA and risk assessments.
• Support customer design reviews and qualification activities.
• Contribute to Design Rule Manuals and product specifications.

Qualifications:

• M.S. in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related engineering discipline.
• 2+ years of experience in modeling, simulation, semiconductor packaging, electronics, or advanced materials development.

Required Skills:

• Finite Element Analysis (FEA)
• HFSS
• Maxwell
• SI wave
• Thermomechanical
• Thermal modeling
• Multi-physics simulation
• Electromagnetic simulation
• De-embedding techniques
• Resonance and impedance analysis

Preferred Skills:

• Equipment and Software:
• ANSYS Mechanical
• ANSYS Electronics Desktop
• HFSS
• SI Wave
• COMSOL Multiphysics
• Abaqus
• Keysight ADS
• Python
• MATLAB
• JMPLT Spice

We provide competitive salary and benefit plans.

Equal Opportunity Statement

Reasonable accommodation may be made to enable individuals with disabilities to perform the essential functions.