Module Engineer (Contract)

About the role

As a Module Engineer (Ball Attach), you will be responsible for sustaining and optimizing ball attach manufacturing processes within Intel's high-volume semiconductor assembly operations. You will drive process stability, equipment performance, yield improvement, and defect reduction while ensuring product quality and manufacturing efficiency. Working closely with cross-functional teams, equipment suppliers, and global manufacturing partners, you will play a key role in supporting technology development, process transfers, and continuous improvement initiatives that enable Intel's advanced packaging and assembly capabilities.

Key responsibilities

• Own and sustain Ball Attach manufacturing processes and equipment to achieve safety, quality, productivity, and yield targets.
• Monitor and control key process parameters to ensure compliance with product specifications and manufacturing requirements.
• Perform process characterization, troubleshooting, root cause analysis, and corrective actions to address yield, quality, and reliability challenges.
• Drive continuous improvement initiatives through DOE, SPC, and data-driven methodologies to optimize process capability and equipment performance.
• Partner with equipment vendors and internal stakeholders to improve tool reliability, utilization, and manufacturing readiness.
• Develop and implement preventive measures to minimize process excursions, defects, and equipment-related issues.
• Support equipment installation, qualification, conversion, and production ramp activities while ensuring adherence to safety and quality standards.
• Collaborate with cross-functional teams including Process Engineering, Manufacturing, Quality, Product Engineering, and Equipment Engineering to resolve technical challenges.
• Lead technology transfers, process qualifications, and manufacturing readiness activities across local and global sites.
• Maintain process documentation, operating procedures, specifications, and technical reports to support operational excellence.

About you

• Bachelor's degree in Electrical Engineering, Electronic Engineering, Mechanical Engineering, Chemical Engineering, Materials Engineering, Physics, Semiconductor Technology, or a related discipline.
• Minimum 4 years of relevant experience with a Bachelor's degree, 3 years with a Master's degree, or 0 years with a PhD.
• Experience in semiconductor manufacturing, assembly, packaging, or high-volume manufacturing environments.
• Knowledge of process engineering fundamentals, statistical analysis, and problem-solving methodologies.
• Experience in Ball Attach, Die Attach, Flip Chip, Advanced Packaging, Assembly, or Backend Semiconductor Manufacturing processes (preferred).
• Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), FMEA, and Root Cause Analysis methodologies (preferred).
• Strong understanding of semiconductor manufacturing equipment, process characterization, and yield improvement techniques (preferred).
• Experience with equipment qualification, troubleshooting, maintenance coordination, and performance optimization (preferred).