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Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)

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Onsite

Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)

Intel Corporation

Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)

Skills

PythonMATLABData AnalysisMachine LearningWorkday

11 days ago

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Important information


Contract type:

Permanent

Salary:

$120,898 – $120,902 / year

Location:

Hillsboro, OR, USA

Work mode:

Onsite

Published on:

13 October 2026

What they need


Job Details:

Job Description:

The Role and Impact

As a Module Engineering PhD Intern, you will contribute to the development and optimization of semiconductor manufacturing processes for a specific module. You will engage in sustaining and improving manufacturing equipment performance, troubleshooting issues, and supporting qualification activities. This internship offers an excellent opportunity to apply your academic research to practical engineering challenges, gain hands-on experience, and explore your future career potential in a fast-paced, innovation-driven environment.

Business group

Intel Foundry is dedicated to advancing semiconductor manufacturing technologies and delivering innovative solutions that meet the needs of customers worldwide. As a part of this organization, you will join a team focused on optimizing manufacturing processes, sustaining equipment performance, and driving production excellence, while contributing to Intel's broader mission of technological leadership.

Key Responsibilities

  • Support the development and optimization of semiconductor manufacturing processes for a specific module.
  • Sustain and improve manufacturing equipment performance to ensure operational reliability and efficiency.
  • Assist in troubleshooting equipment issues and performing qualification activities to meet production standards.
  • Collaborate with engineering teams to refine process control methodologies and achieve production goals.
  • Apply advanced statistical analysis and experimental design to improve process reliability and throughput.
  • Gain hands-on experience with materials and device characterization techniques, including SEM and TEM.
  • Contribute to continuous improvement initiatives for process control systems and methodologies.

Qualifications:

Minimum Qualifications

  • Must be actively pursuing a PhD degree in Materials Science Engineering, Physics, Chemistry, Electrochemistry or Chemical Engineering
  • 3+ months of educational, research, laboratory, internship, or industry experience.
  • Demonstrated hands-on experience through academic research, laboratory work, internships, coursework, or technical projects.
  • Basic understanding of semiconductor manufacturing processes, process integration, or advanced manufacturing methodologies.

Preferred Qualifications

  • Experience with data analysis, statistical methods, and process optimization techniques.

  • Strong academic performance with a cumulative GPA of 3.0 or higher preferred.

  • Demonstrated deep expertise in chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion/passivation mechanisms, or surfactant-assisted cleaning/drying mechanisms (e.g., Marangoni drying, supercritical CO2).

  • Hands-on experience with advanced thin-film, surface, and chemical characterization techniques (e.g., Ellipsometry, AFM, SEM/TEM, XPS, contact angle goniometry, FTIR, TXRF, or ICP-MS).

  • Experience with automated fluidic systems, wet processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics/mass-transfer troubleshooting.

  • Demonstrated experience utilizing Python, MATLAB, JMP, or Machine Learning for design of experiments (DOE), multivariate statistical analysis, or process automation.

  • Strong publication record, conference presentations, or filed patent applications demonstrating systematic problem-solving in experimental chemical and materials science.

Take the next step in your career journey by joining a collaborative, innovative team where your contributions will help shape the future of semiconductor technology.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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