嘉盛半导体(苏州)有限公司
塑封工艺工程师 Molding PE
2 months ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
9 August 2026
What they need
该职位来源于猎聘 职位描述：
- Assembly mold yields improvement . 提升良率
- Driving assembly CIP for top defects and reduce O/S failure rate 驱动封装CIP，降低O/S故障率
- Establish/Update Control Plan, FMEA, OCAP and SOP for process optimization.
建立/更新控制计划，FMEA, OCAP和SOP以优化工艺。
- Customer audit handling and supplier qualification. 处理客户审核和供应商资格认证
- Customer complaint disposition and 8D report preparation. 处理客户投诉，准备8D报告 职位要求：
- Bachelor and above degree . 本科及以上学历 2. 5years semiconductor mold process . 5年以上半导体塑封工艺
- Good oral and written English.Good organizing &analytical skills . 良好的英语听说读写能力、组织能力、分析能力
- Good communication and coordination spirit during work. 良好的沟通协调能力
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