Molding Process Engieer

• Take charge of molding process for SiP products, ensure products meet appearance, functional and reliability requirements, guarantee manufacturability and long-term stability.

• Be familiar with structure and proficient in operation of Fico molding equipment.

• Independently analyze and solve common molding defects such as bubble, delamination, flash, warpage, void and cracking.

• Skilled in applying 8D, fishbone diagram, DOE, SPC and other engineering & quality analysis tools.

• Lead productivity promotion and quality improvement projects in mass production molding process.

Qualification

1.Education: Bachelor degree or above

2.Major: Electronic Information, Microelectronics, Automation, Mechatronics, Mechanical Manufacturing, Industrial Engineering and other related majors

3.Work Experience: More than 2 years working experience in Molding process of semiconductor & chip packaging industry, familiar with molding materials, molds, injection parameters and defect improvement is preferred.

4.Rigorous and meticulous in work, strong execution ability, focus on process detail control.

5.Clear logical thinking, good at analyzing production defects and quickly locating process problems.

6.Good communication and coordination skills, able to cooperate with production, quality and equipment teams for improvement.

7.Excellent communication and coordination skills, good at multi-department management and team cohesion building

8.Proactive and eager to learn, dedicated to researching new technologies and improving production yield.

9.Skilled in data sorting, good at summarizing experience and compiling standardized process documents.