Molding Process Engineer

该职位来源于猎聘 职责描述： 1、Responsible for the Mold, Mark,Saw process capability and yield improvement

负责Mold ,Mark,Saw 站的制程能力的提升及良率改善 2、Daily technical support and training, the file to develop and system improvement

日常相关技术支持和产线培训，文件制定及系统完善 3、New processes, new materials evaluation and import

Mold mark新制程、新材料的评估与导入 4、The implementation and plans of projects cost reduction

Mold mark成本降低项目的实施和计划 任职要求： 1、 Bachelor and above degree

本科及以上学历 2、 At least 5 years in semiconductor background

五年以上半导体经验 3、Familiar with process management methods and requirement

熟悉相关制程管理方法及要求 4、Mastering all failure principle, measures and improve methods

掌握各种常见失效的产生原理、应对措施及改善方法