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半导体Molding设备工程师MD(成都)

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半导体Molding设备工程师MD(成都)

日月新半导体有限公司

半导体Molding设备工程师MD(成都)

3 months ago

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Important information


Contract type:

Permanent

Location:

Chengdu, Sichuan, China

Work mode:

Onsite

Published on:

8 August 2026

What they need


该职位来源于猎聘 工作内容: 1、机况、品质异常分析改善和报告汇整 2、负责设备能力提升专案,成本管控 3、技术员培训计划制定,对技术员周期系统培训 4、负责协助公司设备管理体系的建立与实施 5、负责设备技术、维护状态的分析与评价 6、负责所辖区域设备的维护与保养,及时处理设备现场的技术问题 7、负责设备技术革新、改造及相关资料、情报的收集与积累 8、负责机台导入、安装、调试等 任职资格: 1、大专及以上学历 2、5年以上工作经验 3、有半导体Molding设备操作经验,能独立完成设备维修保养者优先

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