成都钛和科技有限公司
MOS/SGT产品开发经理
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
29 August 2026
What they need
该职位来源于猎聘 About the role The candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will lead products successfully in internal or external foundries. Interface with the various departments regarding their foundry/BE subcon technology needs. What you will do
- Ensuring the manufacturability of power chips (IGBT/FRD), from R&D to product release, at internal or external foundries if required
- Responsible for creating and maintaining all documents (GDS/JDV, DRC, Tape-out/DOE/Design Change Forms, etc) to support new technology development
- Responsible for assessing design/layout violations and following actions
- Making contributions to the product design & development, process integration and testing (static/dynamic, reliability and etc.)
- Evaluating and debugging test methods to improve test stability and yield in manufacturing
- Technical documents preparation, datasheet, product change notice, etc.,
- Work with marketing, quality, and other department to improve design, ensure product release
- Write the Technical Purchasing Specifications for new products and sustain the existing files What you will need Hard Skills:
- Basic knowledge in power device physics and semiconductor device processing.
- Understanding of layout principles
- Knowledge in failure analysis and able to conduct 8D and FMEA
- Ability to handle multi-product power device testing
Soft Skills
- Master’s degree or above majored in Microelectronics or semiconductor related field
- Creative thinker with top view, capable of finding an appropriate solution to complex problems.
- Team player, able to work in a cross-functional-team environment.
- Good Communication skills in both oral and written English.
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