MSG专家

该职位来源于猎聘 职责： 1. 负责MSG压力传感器研发，覆盖机械拓扑设计、产品精度参数、PCBA layout、芯片选型、校准软硬件等关键技术。 Responsible for MSG pressure sensor development, cover mechanical layout design, product accuracy parameter, PCBA layout, ASIC define, calibration hardware & software, etc. 2. 负责MSG port头的自主生产导入，包括材质选型、热处理参数、玻璃胶型号、微熔参数、MEMS选型等关键环节。 Responsible for self-production of MSG port, including material define, heating treatment, glue code, msg parameter, MEMS define, etc. 3. 建立MSG压力传感器的通用spec体系，包括EOL测试项、DV验证计划、Know How&lesson learned数据库等。 Establish MSG pressure sensor common spec system, including EOL test list, DV validation plan, Know How & lesson learned database, etc. 4. 跨部门协作，主导团队解决MSG压力传感器的开发问题与失效分析。 Cross-departmental collaboration, lead team to solve technical problem and failure analysis during MSG pressure sensor development. 5. 支持工艺生产团队，提供验收spec与经验参考，包括Bonding工艺、Gel保护工艺、激光焊接工艺等。 Support process team, provide criteria spec and experience, including bonding process, gel dispensing process, laser welding process, etc. 6. 支持其它电桥机制的低中高压端的压力传感器研发，包括溅射薄膜技术、扩散硅技术等。 Support other bridge type pressure sensor development with low, mid, high pressure range, such as Thin film technology, Diffused silicon technology, etc. 要求： 1. 机械电子、车辆工程、微电子、材料等相关专业。 Mechatronics, Vehicle engineer, Micro-electronics, Material, etc. 2. 具备5年以上，汽车MSG压力传感器产品开发深度参与经验，能够自主完成从开发到SOP的全流程技术工作。 With over 5 years of deep experience in automotive MSG pressure sensor product development, we are able to independently complete the entire technical process from R&D to SOP. 3. 熟悉MSG压力传感器的工作原理、结构拓扑、材料与制造工艺。 Familiar with the working principles, structural topology, material and manufacturing process of MSG pressure sensors. 4. 具备电子硬件设计优先。 With electronics hardware design ability is preferred. 5. 具备瑞萨ASIC芯片校准能力优先。 With Renesas ASIC calibration ability is preferred. 6. 英语良好，至少可以读写。 Good English, at least can write and read. 7. 跨部门和跨公司协作沟通能力，具备较强的闭环能力。 Cross-departmental and cross-company collaboration and communication skills, with strong ability to close the loop.