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MST – Etch

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Onsite

MST – Etch

NXP Semiconductors

MST – Etch

Skills

Workday

16 days ago

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Important information


Contract type:

Permanent

Location:

United States

Work mode:

Onsite

Published on:

8 October 2026

What they need


Job Responsibility:

Job Summary:

  • Daily tasks will include rebuilding and cleaning subassemblies for semiconductor manufacturing equipment.
  • Performing Preventative Maintenance (PM) tasks
  • Following and continuous improvement of WSS Documents
  • Completed Post Maintenance Qualifications and checks
  • Support of subfab equipmentChemical handlingensuring an adequate supply of consumables for rebuilding sub-assemblies.
  • Candidate must possess good mechanical aptitude and troubleshooting abilities.
  • Candidate must be detail oriented and able to create and follow written procedures.
  • Candidate should have an understanding of electronic, mechanical, and vacuum systems.
  • Strong verbal and written communication skills.
  • Ability to interact professionally in a fast-paced production environment.
  • Knowledge of 5S principles and experience maintaining 5S organization within maintenance or parts management environment.

Job Qualifications:

  • Minimum educational requirements are High School Diploma or Equivalent.
  • 2-3 years of previous equipment maintenance and/or parts management is advantageous.
  • Prefer 3 to 5 years of related wafer fab experience with an emphasis on production equipment.
  • Microsoft Excel knowledge for data entry and tracking

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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