NXP Semiconductors
MST – Etch
Skills
16 days ago
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Important information
Contract type:
Permanent
Location:
United States
Work mode:
Onsite
Published on:
8 October 2026
What they need
Job Responsibility:
Job Summary:
- Daily tasks will include rebuilding and cleaning subassemblies for semiconductor manufacturing equipment.
- Performing Preventative Maintenance (PM) tasks
- Following and continuous improvement of WSS Documents
- Completed Post Maintenance Qualifications and checks
- Support of subfab equipmentChemical handlingensuring an adequate supply of consumables for rebuilding sub-assemblies.
- Candidate must possess good mechanical aptitude and troubleshooting abilities.
- Candidate must be detail oriented and able to create and follow written procedures.
- Candidate should have an understanding of electronic, mechanical, and vacuum systems.
- Strong verbal and written communication skills.
- Ability to interact professionally in a fast-paced production environment.
- Knowledge of 5S principles and experience maintaining 5S organization within maintenance or parts management environment.
Job Qualifications:
- Minimum educational requirements are High School Diploma or Equivalent.
- 2-3 years of previous equipment maintenance and/or parts management is advantageous.
- Prefer 3 to 5 years of related wafer fab experience with an emphasis on production equipment.
- Microsoft Excel knowledge for data entry and tracking
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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