NPI Engineer

To support our rapid business growth and increasing customer project demand, we are seeking a dynamic New Product Introduction (NPI) Executive to lead NPI, technology development, and manufacturing transfer projects across our semiconductor assembly operations—from Front-End of Line (FOL) through to End-of-Line (EOL).

In this role, you will serve as the primary technical and project management interface between customers, suppliers, manufacturing, and internal cross-functional teams. You will drive project execution excellence, process readiness, and customer satisfaction to ensure successful mass production releases within schedule, budget, and quality requirements.

Key Responsibilities

1. Project Management & NPI Execution

• End-to-End Leadership: Lead cross-functional NPI projects from initial project kick-off all the way through to mass production release.
• Project Planning: Develop and maintain detailed project schedules, milestone plans, risk registers, and robust contingency plans.
• Performance Monitoring: Track and report project performance against timelines, cost budgets, quality standards, and customer milestones.
• Lifecycle Management: Manage NPI activities from initial feasibility assessments through qualification, engineering builds, process characterization, and production ramp.

2. Customer & Stakeholder Management

• Primary Interface: Act as the main technical and project interface for customers throughout the entire project lifecycle.
• Reviews & Changes: Lead customer technical reviews, deliver executive business updates, and manage Engineering Change Requests/Orders (ECR/ECO).
• Collaboration: Coordinate with suppliers regarding materials, tooling, equipment, and process readiness, while aligning internal teams to achieve project goals.

3. Technical Coordination & Process Tracking

• Process Oversight: Coordinate and monitor full-cycle semiconductor assembly processes, including:

  • Wafer Prep, Back Grinding, Dicing, and Die Attach.
  • Flip Chip / Cu Pillar Assembly and Wire Bonding.
  • Molding/Compression Molding, Singulation/Tape Saw, and Trim & Form.
  • Marking, Reliability Qualification, and Packaging/Shipment Readiness.

• Advanced Evaluation: Support package development, DFM/DFX reviews, and evaluate new assembly technologies, materials, tooling, and equipment platforms.

4. Problem Solving & Quality Compliance

• Structured Troubleshooting: Lead structured problem-solving and failure analysis activities using 8D, DMAIC, and Root Cause Analysis (RCA) methodologies.
• Risk Mitigation: Identify technical, operational, and supply chain risks early; develop proactive mitigation plans and drive critical issues to closure.
• Standards & Audits: Ensure absolute compliance with ISO 9001, IATF 16949, customer specifications, and internal quality standards while supporting audits.

Requirements & Qualifications

Education & Experience

• Academic Background: Bachelor’s Degree or Diploma in Engineering (Mechanical, Electrical, Electronics, Materials, Manufacturing, or an equivalent technical field).
• Industry Experience: Proven track record in project management or NPI engineering within a semiconductor manufacturing or assembly environment.
• Valued Certifications: Project Management (PMP) or Lean Six Sigma certifications are considered strong advantages.

Technical Skills & Competencies

• Semiconductor Packaging: Familiarity with Leadframe/Substrate packaging (QFN, DFN, BGA, LGA, SiP), MEMS, Silicon Photonics, Flip Chip, Cu Pillar, Wire Bonding, and Encapsulation.
• Project & Change Management: Strong skills in project scheduling, Budget/CAPEX management, risk mitigation, and change control.
• Quality Methodologies: Solid understanding of Lean Manufacturing, Six Sigma, 8D, and Automotive Semiconductor Qualification processes.

Requirements:

Experience: Preferably with 3 years of hands-on experience in semiconductor assembly/packaging, specifically focusing on NPI or Project Management

Fresh graduates are encouraged to apply as well.