NPI Engineering Manager (Mold Process)

Our client is a leading global semiconductor manufacturing company specializing in semiconductor assembly, packaging, and testing. The company provides advanced manufacturing solutions to leading customers in the semiconductor industry.

Job Description:

• Lead and manage engineers and technicians to improve manufacturing processes, product quality, and overall performance.
• Lead NPI molding activities, including DOE, molding parameter evaluation, and process verification for new products.
• Provide technical support for De-Junk, Trim & Form, troubleshooting, and problem-solving activities.
• Drive action plans, KPIs, and continuous improvement initiatives to achieve business targets.
• Lead the team in resolving quality issues and work closely with Production, Quality, Equipment, and customers on technical matters.

Qualifications:

• Bachelor's Degree in Semiconductor Physics, Engineering, or a related field; Master's Degree is an advantage.
• 8+ years of experience in semiconductor backend assembly.
• Experience in molding processes and/or QFN, TSSOP, or SOIC products is preferred.
• Strong analytical, problem-solving, and team leadership skills.
• Good English communication skills and ability to work effectively with cross-functional teams.