NPI Process Development Engineer

• Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.

• Responsible for quality, yield, cost and process improvement activities.

• Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.

• Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.

• Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements:

• 3-6 yearsof work experience with semiconductor assembly background for automotive customers.

• Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.

• Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.

• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.

• Good SPC, Process Control and other relevant statistical & problem-solving skills

• Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia...

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